Strip sockets for board interconnects in small-form-factor wearable devices introduced by Mill-Max
OYSTER BAY, N.Y. – Mill-Max Manufacturing Co. in Oyster Bay, N.Y., is introducing low-profile strip sockets to provide a reliable way to connect boards or devices in rugged small-form-factor electronics like wearable devices for military and medical applications.
The strip sockets offer an above-board height of 0.083 inches. The 315-43-1XX-41-004000 (single row) and 415-43-2XX-41-004000 (double row) sockets have 0.1-inch pin spacing with a low profile of 0.083 inches.
They are designed for through-hole mounting in boards as thick as 0.062 inches, providing a secure connection to the circuit board. These sockets are for board stacking and wire-to-board applications where minimizing package height is paramount.
When mated with Mill-Max low profile headers, 335-10-1XX-00-160000 (single row) and 435-10-2XX-00-160000 (double row), the total between the boards height is 0.155 inches.
For wire-to-board connections the Mill-Max 380-10-1XX-00-002000 (Single row) and 480-10-2XX-00-002000 (Double row) solder cup headers combine with the super low-profile sockets to achieve a total height of 0.268 inches.
Each receptacle is precision turned from brass alloy, has a four-finger, beryllium copper contact, accepts leads ranging from 0.015 inches to 0.22 inches, and is designed to withstand the rigors of rugged applications associated with portability.
The insulator material is high-temperature PCT, compatible with most soldering processes. Connectors are available from 1 to 32 positions, single row and 4 to 72 positions double row.
Standard plating options include tin or gold for the outer shell and gold for the internal contact providing optimal interconnect reliability.
For more information contact Mill-Max online at www.mill-max.com.
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