Multi-core processing Com Express embedded computing for artificial intelligence (AI) offered by Congatec

Summary points:

• Congatec introduces the conga-TCRP1 COM Express 3.1 Type 6 Compact modules delivering up to 59 TOPS of AI inference, powered by AMD Ryzen AI Embedded P100 processors with integrated XDNA2 NPU.
• Designed for robotics, transportation, and industrial automation, the modules operate from -40 to 85 C and combine Zen5 and Zen5c cores for strong performance with low power consumption.
• Featuring Radeon RDNA 3.5 graphics with up to four 4K displays, as much as 96 gigabytes of DDR5-5600 RAM with optional ECC, and configurable PCI Express Gen4 lanes for high-bandwidth embedded computing.

SAN DIEGO – Congatec Inc. in San Diego is introducing the conga-TCRP1 COM Express 3.1 Type 6 Compact module series for entry-level artificial intelligence (AI) in robotics, transportation, and industrial automation applications.

The conga-TCRP1 modules are based on the latest AMD Ryzen AI Embedded P100 series processors with four or six cores that operate in temperatures from -40 to 85 degrees Celsius.

They accelerate embedded computing applications with as much computing power as 59 trillion operations per second (TOPS) of combined AI inference performance, with as much as 50 TOPS from the XDNA2 NPU.

The computing cores of the conga-TCRP1 are based on the AMD Zen5 architecture with performance-oriented Zen5 cores combined with Zen5c cores designed for maximum energy efficiency. This ensures extremely low power consumption of the modules while delivering high overall efficiency and a single-thread performance to 4.5 GHz.

Key advantages

For application developers, a key advantage of this multi-core processing architecture is a common architecture on which the Zen5 and Zen5c cores are based. This ensures consistent execution timing in deterministic applications and optimizes real-time performance.

In addition to the Zen5/5c cores and the Radeon RDNA 3.5 GPU, which supports as many as four independent display connections with immersive 4k graphics, the integrated XDNA2 NPU provides as much as 50 TOPS of AI performance.

At the same time, memory-intensive applications benefit from 96 gigabytes of DDR5-5600 RAM with optional Error Correction Code (ECC) for mission-critical applications. As many as eight configurable PCI Express Gen4 lanes and PEG x4 Gen4 are available.

For more information contact Congatec online at www.congatec.com/en/products/com-express-type-6/conga-tcrp1.