Congatec adds higher-core variants to Ryzen AI embedded COM Express module lineup

The updated conga-TCRP1 modules are now available in six new configurations featuring eight-, ten-, or twelve-core CPU options.
April 13, 2026
2 min read
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DEGGENDORF, Germany - Congatec in Deggendorf, Germany, announced it has expanded its COM Express 3.1 Type 6 Compact module portfolio with new variants of its conga-TCRP1 based on the AMD Ryzen AI Embedded P100 Series, increasing scalability for embedded and edge artificial intelligence (AI) applications.

The updated conga-TCRP1 modules are now available in six new configurations featuring eight-, ten-, or twelve-core CPU options. Developers can scale performance from 4 to 12 CPU cores and from 2 to 16 GPU compute units, enabling flexible balancing of CPU, GPU, and neural processing unit (NPU) resources within a single module design.

The modules are built on AMD’s Zen 5 and Zen 5c CPU architecture using 4-nanometer process technology, designed to deliver deterministic performance for real-time and latency-sensitive workloads. Integrated Radeon RDNA 3.5 graphics and XDNA2 NPU technology provide up to 50 tera operations per second (TOPS) of AI compute capability, targeting edge AI use cases that require local processing without cloud connectivity.

The conga-TCRP1 modules support up to 96 gigabytes of DDR5-5600 memory, with optional error correction code (ECC) for mission-critical systems. Connectivity includes up to eight PCIe Gen4 lanes, 2.5 Gigabit Ethernet, USB 3.2 Gen2 and USB 2.0 interfaces, and storage options such as onboard NVMe solid-state drives or dual SATA interfaces.

The integrated NPU enables local execution of smaller large language models (LLM) and parallel AI workloads such as anomaly detection, visual inspection, and optical character recognition, while maintaining real-time system operations.

Target applications include mobile medical imaging, industrial machine vision, smart city infrastructure such as traffic monitoring systems, robotics, transportation, and gaming platforms. The modules are designed to operate across a wide thermal envelope, supporting both passively cooled and ruggedized deployments.

Supported operating systems include Microsoft Windows 11, Windows 11 IoT Enterprise, Linux, Ubuntu Pro, ctrlX OS, and Kontron OS. The modules are also available as application-ready configurations with preinstalled software environments and optional hypervisor support for workload consolidation.

For more information, please visit https://www.congatec.com.