Performance Uplift for High-End Edge Computing Platforms with the Latest Intel® Xeon® D-2800 and D-1800 Processors

Feb. 26, 2024

Ismaning, Germany, February 26, 2024 – Kontron, a leading global provider of IoT/Embedded Computer Technology (ECT), introduces the COM-HPC® Server Module COMh-sdID based on the Intel® Xeon® D-2800 processor, along with the COMh-sdIL and the COM-Express® basic featuring the Intel® Xeon® D-1800 processor. These three modules offer application developers impeccable scalability and flexibility for high-end edge computing.

The COMh-sdID Server Module, measuring 160 x 160 mm with scalability ranging from 4 to 20 cores, features 4x DIMM sockets supporting up to 512 GB DDR4 memory at 3200 MT/s. Optionally, a soldered NVMe SSD onboard with up to 1 TByte storage capacity is available as a storage medium. It boasts 48x PCIe lanes (32x PCIe Gen4 plus 16x PCIe Gen3 lanes) and 2x Quad LAN interfaces, supporting up to 100 Gbit Ethernet, providing extensive interface and communication options.

In "Size D small" format, the COM-HPC® Server Module COMh-sdIL, with dimensions of 120 x 160 mm, is even more compact than the standard COM-HPC® Size D design (160 x 160 mm). With all components soldered, the module is highly resistant to shock and vibration, making it ideal for outdoor applications. Equipped with 16x PCIe Gen4 plus 16x PCIe Gen3 lanes and a maximum of 64 GB soldered DDR4 memory at 2933 MT/s, it offers a soldered NVMe SSD onboard with up to 1 TByte storage capacity as an optional storage medium.
The COM-Express® basic COMe-bID7, based on the Intel® Xeon® D-1800 processor, offers scalability from 4 to 10 cores in a small form factor, enabling robust and space-saving implementations in harsh environments and under extreme conditions. The module features up to 4x SO-DIMM sockets supporting a maximum of 128 GB memory. Optionally, a soldered NVMe SSD onboard with up to 1 TByte storage capacity is available. With 16x PCIe Gen4 plus 16x PCIe Gen3 lanes and 4x 10GBASE-KR interfaces, it provides ideal support for high data throughput rates in challenging I/O and network structures.
Robust and Scalable High-Performance Modules

All three modules are equipped with SKUs for operation in an extended industrial temperature range of -40 °C to +85 °C and ensuring 24/7 reliability for 10 years. These features guarantee highly robust implementations for harsh environments and extreme conditions within a small mechanical footprint. With scalable performance, complemented by Intel® QuickAssist Technology (QAT) and AI acceleration with Intel® AVX-512, the modules are perfectly suited for use in complex AI applications, high-performance network platforms, and edge servers. Featuring real-time capabilities, low latency, and determinism with Intel® Time Coordinated Computing (TCC) and Time Sensitive Networking (TSN), these platforms are ideal for high-performance IoT edge computing applications.

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