The Dawn ATR-3500 Series Rugged Enclosure offers a unique and innovative cooling concept, Thermal Exchanged Flow (TEF), in conjunction with standard Micro-TCA board platforms, resulting in the most cost-effective, rugged solution available. The TEF uses a two-stage cooling system consisting of a completely-sealed inner housing and forced air outer-housing. The inner-housing incorporates the power module, MCH module and up to four AMC modules.
• MicroTCA Rugged Conduction-Cooled Solution • 100% Sealed Electronics Compartment • Six-slot MicroTCA Backplane • Precision-Machined Card Guides result in Maximum Tolerances