The XPand6240 is a true Commercial-Off-The-Shelf (COTS) rugged system based on the Intel® Xeon® D-1700 series (formerly Ice Lake-D) of processors and a Gigabit Ethernet switch optionally hosting an XChange6300 Cisco IOS-XE® Gigabit Ethernet Embedded Services Router.
With a compact design, the XPand6240 maximizes processing and networking performance while providing a SWaP-optimized alternative to traditionally larger slot-based systems; it is an actual Small Form Factor (SFF) system based on COTS 3U VPX modules.
The XPand6240 is a true Commercial-Off-The-Shelf (COTS) rugged system based on the Intel® Xeon® D-1700 series (formerly Ice Lake-D) of processors and a Gigabit Ethernet switch optionally hosting an XChange6300 Cisco IOS-XE® Gigabit Ethernet Embedded Services Router. With a compact design, the XPand6240 maximizes processing and networking performance while providing a SWaP-optimized alternative to traditionally larger slot-based systems; it is an actual Small Form Factor (SFF) system based on COTS 3U VPX modules.
The XPand6240’s first slot supports the XPedite7770 Intel® Xeon® D-1700 processor-based 3U VPX SBC. The XPand6240’s second slot supports the XChange3031 3U VPX Gigabit Ethernet switch. The XChange3031 can be configured as a fully managed Layer 2 switch. The XChange3031 delivers full wire-speed across all of its ports and supports jumbo packets up to 12 kB. It supports IPv6, Energy Efficient Ethernet™ (EEE), and a comprehensive set of IETF RFCs and IEEE protocols. The XChange6300 Cisco IOS-XE® router XMC can optionally be installed on the XChange3031 to provide highly secure data, voice, and video communications to stationary and mobile network nodes. The system supports a memory module bay to host a removable PCI Express Solid-State Drive (SSD) flash memory module.
The XPand6240 supports the rear I/O from the installed VPX modules with two 130-pin circular connectors. This fully ruggedized system is designed to meet the rigorous standards of MIL-STD-810 and DO-160, while integrating the latest power-saving and performance-enhancing technology. The heat from the internal conduction-cooled modules is conducted to sidewall heat exchangers, where it is dissipated to the ambient environment by convection cooling and to an attached cold plate by conduction cooling. The system includes an integrated MIL-STD-704 28 VDC power supply and MIL-STD-461 EMI filtering.
*X-ES tests against portions of MIL-STD-461, MIL-STD-810, and MIL-HDBK-704. Please contact factory for details.
