First Level Inc

York, PA 17406


About First Level Inc



3109 Espresso Way
York, PA 17406
United States

More Info on First Level Inc

Provides die attach/ wire bonding Manufacturing Services specializing in miniaturization of Microelectronic Packaging & precision placement assembly of surface mount components. Applications include Solar (CPV), LED, Electronic Sensors,Optoelectronics, LCD, Microwave, Medical Devices, Light Engines, and Hybrid/Custom Modules. "Prototype to Production" Expertise in Flip Chip, Die Bonding, Wire

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