Experts at Space Electronics in San Diego, needed a low-cost, high-density memory for their RADPAK solid state memory product for commercial satellite applications. They found their answer with the M-Densus, a 3-D high-density memory module from Dense-Pac Microsystems, Inc. in Garden Grove, Calif.
The Space Electronics device is part of a system that will replace satellite storage tape, which is slow and less reliable compared to solid-state memory for digital communications. The new single-memory device is as large as 1 gigabit.
"Dense-Pac provided a solution that enables us to offer new products to our customer base," says David Strobel, president of Space Electronics. "Space Electronics RAD-PAK technology will allow satellite designers to incorporate high-density, radiation-tolerant solid state memory into their systems at a fraction of the cost of traditional radiation hard memory, while also saving room."
The solid state memory "gave us a density we`ve never seen before," says Stuart Shanken, sales and marketing manager at Space Electronics. It uses the thin small outline package (TSOP) technology to save space and increase density, Shanken says.
The M-Densus series is a family of interchangeable memory modules. The 64 megabit M-Densus have been designed to fit in the same footprint as Dense-Pac`s 8 Megabit-by 8 DRAM TSOP monolithic devices and are backward compatible with the 16 Megabit-based family of M-Densus modules. -J.M.
For more information on M-Densus or Dense-Pac contact Rachel Reynolds by phone at 714-898-0007, by fax at 714-899-7556, by mail at 7321 Lincoln Way, Garden Grove, Calif 92841, by e-mail at [email protected], or on the World Wide Web at www.dense-pac.com.
The VGM1 (Gemini) PowerPC board from Synergy Microsystems, pictured above, controls the radar processing in the Surface Search Radar project at the Raytheon Naval and Maritime Systems for the U.S. Coast Guard and Navy.
