Elma introduces front panels for rugged electronic enclosures that act like heat sinks

FREMONT, Calif., 12 April 2009. Elma Electronic Inc. in Fremont, Calif., is introducing front panels for rugged electronic enclosures for military and aerospace applications that also act as heat sinks for electronic thermal management. The panels dissipate heat while covering open sections of a cabinet enclosure.

FREMONT, Calif., 12 April 2009. Elma Electronic Inc. in Fremont, Calif., is introducing front panels for rugged electronic enclosures for military and aerospace applications that also act as heat sinks for electronic thermal management. The panels dissipate heat while covering open sections of a cabinet enclosure.

The Elma heat sinks are for all types of devices to provide extra heat dissipation in military and aerospace, industrial, medical, transportation, consumer, test & measurement, and communications applications.

The heat sink front panels come in various sizes and configurations, but are specifically for 19-inch rack technology. The cooling fin extrusion has a width of 42 HP and comes in 1U high increments.

The Elma front panel heat sinks are inexpensive aluminum-based, are easy to cut and machine, have high thermal capacity, low density, and light weight. Other materials are available on request.

The heat sink surfaces are black anodized, providing an order of magnitude higher emissivity than an untreated surface. Clear-anodized versions are also available.

Each fin is built on a 1.5 HP pitch for enough space in between for screw heads. Therefore the fins do not need to be modified for mounting. EMC versions with a mounting bracket for gaskets are also available.

For more information contact Elma online at www.elma.com.

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