Radiation-hardened ACS device introduced by Space Micro for high-power switching in missiles and satellites

SAN DIEGO, 13 July 2010. Space Micro Inc. in San Diego is introducing the SM-DACS-1000 radiation hardened miniature valve driver and divert attitude and control systems (DACS) driver card for space-qualified high-power switching applications in missile systems, as well as in commercial and military satellites. Space Micro developed the SM-ACS-1000 technology under supervision of the U.S. Missile Defense Agency (MDA) in 2007 when the MDA awarded Space Micro a Small Business Innovative Research (SBIR) phase-2 contract to develop a rad-hard ACS electronics module that meets the guidelines of the High Altitude Exoatmospheric Nuclear Survivability-2 (HAENS-2) standard.

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SAN DIEGO, 13 July 2010. Space Micro Inc. in San Diego is introducing the SM-DACS-1000 radiation hardened miniature valve driver and divert attitude and control systems (DACS) driver card for space-qualifiedhigh-power switching applications in missile systems, as well as in commercial and military satellites.

Space Micro developed the SM-DACS-1000 technology under supervision of the U.S. Missile Defense Agency (MDA) in 2007 when the MDA awarded Space Micro a Small Business Innovative Research (SBIR) phase-2 contract to develop a rad-hard DACS electronics module that meets the guidelines of the High Altitude Exoatmospheric Nuclear Survivability-2 (HAENS-2) standard.

The SM-DACS-1000 is for interceptor and space systems that require reliable, miniaturized, high performance radiation-hardened electronics used in high power switching in thruster and ignition functioning. The space electronics DACS device offers 3D stacking technology, radiation hardening to MDA HAENS 2, no latch-up, rugged design for missile and space applications, surface mount packaging, conductive cooling, and available custom versions.

Space Micro’s technology focuses on electronic circuitry to control thrusters to propel a missile or satellite into position to acquire a target, MDA officials say. In either a missile or satellite, minimal space is available for placement of electronics, making miniaturization of such components essential.

Space Micro started with commercially available circuitry components in die form, and stacked them three-dimensionally to reduce circuitry footprint, and to fit many circuits in an area of 0.5 square inches -- 50 times smaller than the space requirements of other commercially available modules, MDA officials say. The module is hermetically sealed in a radiation-hardened alloy made of high-density materials.

For more information contact Space Micro online at www.spacemicro.com.

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