Posted by John McHale
LAFOX, Ill., 25 2010. Richardson Electronics now supplies MaxQ Technology's new line of liquid-cooledcold plates, which provide drop-in mounting capability for the many of the popular Microsemi, Mitsubishi, Powerex, and Semikron power modules used in high power density applications, such as electric vehicle (EV), hybrid electric vehicle (HEV), plug-in hybrid vehicle (PHEV), wind turbines, and industrial motor control.
The drop-in mounting capability eliminates the need for time-intensive designing and testing of a custom cold plate solution. Each of the new cold plates is a proven design with predictable performance, providing very low thermal resistance, low pressure drop, and a robust and reliable metallurgical seal.
From a hydraulic perspective, the low pressure drop (less than 1.6 PSI at 8 LPM flow rate - on the MQT1617) enables a lower pressure pump requirement. These features are made possible with MaxQ's Q-Chill technology. Each cold plate's size is driven by the module footprint for which it is designed, rather than the cold plate cooling limitations.
New MaxQ Technology Liquid-Cooled Cold Plate part numbers are MQT1613, MQT1913, MQT1614, MQT1914, MQT1617, and MQT2414.