Ziptronix DBI process enables 3D integration for Raytheon CMOS ICs
March 31, 2007
MORRISVILLE, N.C., 31 March 2007. Engineers from Ziptronix Inc., a 3D integration company in Morrisville, N.C., are working together with Raytheon Vision Systems in Goleta, Calif., to demonstrate Ziptronix's Direct Bond Interconnect (DBI ) technology with multilayer CMOS integrated circuit processes.
MORRISVILLE, N.C., 31 March 2007. Engineers from Ziptronix Inc., a 3D integration company in Morrisville, N.C., are working together with Raytheon Vision Systems in Goleta, Calif., to demonstrate Ziptronix's Direct Bond Interconnect (DBI ) technology with multilayer CMOS integrated circuit processes (related story).
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