ISSYS wins Phase II SBIR grant from NSF for wafer-scale, hermetic, hybrid integration of MEMS and electronics
YPSILANTI, Mich., 23 Oct. 2007. Integrated Sensing Systems Inc. (ISSYS) won a Phase II Small Business Innovation Research contract from the National Science Foundation (NSF). The two-year project, titled "Wafer-Scale, Hermetic, Packaging of MEMS-Based Systems," is aimed at the development of a novel packaging method to simplify the packaging of MEMS and associated electronics.