Department of Defense contracts Endicott Interconnect Technologies to research, develop electronics packaging technologies
ENDICOTT, N.Y., 30 May 2007. The U.S. Department of Defense has awarded Endicott Interconnect Technologies Inc. a $49 million follow-on production contract that includes a $5 million contract for research and development of electronics packaging technologies, including printed circuit boards and substrates for the next generation of high-productivity computing.