AFRL awards Next Semiconductor $34M for heterogeneous microelectronics development
Key Highlights
- The $34.1 million contract was awarded through a competitive process, with work performed in San Diego until 2031.
- The program aims to develop heterogeneous microelectronics that integrate multiple functions into single packages for improved performance and efficiency.
- Next Semiconductor specializes in high-reliability SoC technologies for aerospace and defense, including RF signal processing and digital communications.
ROME, N.Y. - The Air Force Research Laboratory (AFRL) has awarded Next Semiconductor Technologies Inc., of San Diego, a $34.1 million cost-plus-fixed-fee completion contract to develop heterogeneous microelectronics components under a program called Heterogeneous Microelectronics for Assured Non-Kinetics.
The contract (FA8750-26-C-B021) was awarded through a competitive acquisition that received two offers. Work will be performed in San Diego and is expected to be completed by 2031, according to the Department of Defense (DoD) contract announcement.
AFRL obligated $4.25 million in fiscal 2025 research, development, test and evaluation (RDT&E) funds at the time of award, along with an initial $1,000 in fiscal 2026 RDT&E funds.
Integrated tech
Although the DoD announcement did not provide additional technical details about the program, heterogeneous microelectronics generally combine multiple semiconductor technologies or specialized functions into a single package or system. The approach enables designers to integrate processing, memory, communications, sensing, and other capabilities while optimizing performance, power consumption, and size, weight, and power (SWaP) for demanding applications.
Next Semiconductor specializes in high-reliability system-on-chip (SoC) technologies for aerospace and defense applications. The company's portfolio includes software-defined semiconductor architectures designed for RF signal acquisition, digital signal processing and communications in compact, low-SWaP devices.
In April, the company announced a collaboration with BAE Systems to accelerate development of radiation-hardened antenna processor technology for future space missions. The effort centers on Next Semiconductor's NX450 antenna processor, which the company says combines ultra-wideband RF signal acquisition and generation with reconfigurable onboard digital processing for satellite sensors and communications payloads. BAE Systems said it plans to support the technology for proliferated low-Earth orbit missions while applying its expertise in radiation-hardened electronics to future system-on-chip products.
The DoD announcement did not indicate whether technologies developed under the BAE collaboration are related to the Heterogeneous Microelectronics for Assured Non-Kinetics program.
The Air Force Research Laboratory in Rome, N.Y., is the contracting activity. Work will be performed entirely at Next Semiconductor's facilities in San Diego, with an estimated completion date of 13 September 2031.
