TEWS launches PCIe mixed-signal board built around AMD adaptive SoC
PINNEBERG, Germany - TEWS Technologies in Pinneberg, Germany, has introduced the TPCE646, a PCI Express mixed-signal board that combines an AMD Zynq UltraScale+ MPSoC with high-density analog input and output capabilities for embedded processing, simulation, and signal acquisition applications.
The board is built around the AMD Zynq UltraScale+ XCZU11EG MPSoC, integrating multicore processors with programmable FPGA fabric on a single PCIe x8 Gen 3 card. By combining programmable logic with analog I/O, the platform is intended to enable real-time signal processing closer to sensors and other data sources.
The TPCE646 provides 32 single-ended bipolar analog outputs with ±10 V range at 16-bit resolution, along with eight 16-bit differential analog inputs capable of sampling at up to 5 Msps. TEWS says calibration data is stored on each board to support accurate input and output performance.
The board also includes PCIe x8 Gen 3 connectivity to the programmable logic, optional PCIe x4 Gen 2 connectivity to the processing system, four front-panel differential LVDS lanes, and rear-panel expansion supporting up to 64 configurable MPSoC I/O signals or 32 differential LVDS pairs. Eight Multi-Gigabit Transceivers are available through Samtec FireFly connectors for high-speed board-to-board communication.
Additional features include Gigabit Ethernet, USB-to-UART connectivity, separate DDR4 memory banks for the programmable logic and processing system, JTAG debugging support, and secure device configuration through QSPI flash or microSD storage. The board is specified for operation from -40 C to +60 C.
According to TEWS, the TPCE646 is designed for applications including hardware-in-the-loop simulation, sensor stimulus and data acquisition, radar and electronic warfare signal processing, and industrial automation systems requiring deterministic, real-time control.
For more information, please visit https://www.tews.com/.
