Renesas collaborates with AMD to develop a complete power management solution for the AMD Versal platform

Aug. 1, 2023
Renesas’ new reference design comes with an array of power management devices that have been tested and verified to withstand exposure to high levels of radiation.

TOKYO - Renesas Electronics Corporation in Tokyo have announced a complete space-ready reference design for the AMD Versal adaptive system-on-chip (SoC) XQRVC1902. Developed in collaboration with AMD in Santa Clara, California, the ISLVERSALDEMO2Z reference design integrates key radiation-hardened components for power management, including four new and recently released products in an ultra-compact design. These Intersil-brand ICs are specifically designed to support a wide range of power rails for next-generation space avionics systems that demand tight voltage tolerances, high current, and efficient power conversion while withstanding the harsh environment of space.

As core voltages decrease and currents increase for FPGAs and ASICs, it has become more difficult to meet the power requirements of these devices to ensure that they operate error-free. This is especially critical in space missions where power availability is limited, and systems are exposed to extreme temperatures and radiation for an extended period of time.

To address these challenges, Renesas has collaborated with AMD to develop a complete power management solution for the AMD Versal platform. The Versal Adaptive SoC is an industry-leading space-grade compute platform that delivers full radiation tolerance, accelerated AI inference and high-bandwidth signal processing performance. The ISLVERSALDEMO2Z generates each of the power rails utilized by the Versal platform, including a low 0.80V core voltage supply that can source up to 140 A (amps) of current.

Renesas’ new reference design comes with an array of power management devices that have been tested and verified to withstand exposure to high levels of radiation. These include Pulse Width Modulation (PWM) controllers, GaN FET half-bridge drivers, point-of-load (POL) regulators, power and enable switches, and power sequencers. The devices come in small-footprint packages, so the core power rail components take up just 104 square centimeters of board area, approximately equivalent to two business cards.

For more information, please visit https://www.renesas.com/us/en. 

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