Heat-pipe-assisted HiK Plate heatsinks for power electronics cooling introduced by ACT

LANCASTER, Pa., 30 Nov. 2010. Advanced Cooling Technologies Inc. (ACT) in Lancaster, Pa., is introducing the heat-pipe-assisted HiK Plate heatsinks for power electronics cooling applications involving insulated gate bipolar transistors (IGBTs), thyristers, intelligent power modules (IPMs), symmetric gate commutated turn-off thyristors (SGCTs), and silicon controlled rectifiers (SCRs).

Nov 30th, 2010
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LANCASTER, Pa., 30 Nov. 2010. Advanced Cooling Technologies Inc. (ACT) in Lancaster, Pa., is introducing the heat-pipe-assisted HiK Plate heatsinks for power electronics cooling applications involving insulated gate bipolar transistors (IGBTs), thyristers, intelligent power modules (IPMs), symmetric gate commutated turn-off thyristors (SGCTs), and silicon controlled rectifiers (SCRs).

"This is a natural extension of our HiK plate product line which was originally developed for military electronics cooling, particularly heat spreading in standard ruggedized packaging," says Scott Garner, vice president of ACT's Electronics Products group.

Power electronic devices dissipate large amounts of heat relative to their package footprints, which requires a heatsink significantly larger than the device for electronics thermal management. This results in large conduction-induced temperature gradients within the heatsink, ACT officials explain.

The HiK plates isothermalize the heatsink base to minimize the conduction gradients. The embedded heat pipes are integrated into the heatsink base plate, without influencing weight or volume. For more information contact ACT online at www.1-act.com.

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