Military researchers continue their efforts to convert microelectronics waste heat to electricity
ARLINGTON, Va. – U.S. military researchers are approaching industry for a project to capture waste heat from microelectronics components and convert this dissipated heat into electricity at the chip, substrate, and package levels.
Officials of the U.S. Defense Advanced Projects Agency (DARPA) in Arlington, Va., issued a request for information (DARPA-SN-25-70) last week for the Embedding Electricity Generation from Heat in Microsystems project.
The DARPA Microsystems Technology Office seeks to identify:
-- commercially available graphics processing units (GPUs), central processing units (CPUs), neural processing units, monolithic microwave integrated circuits (MMICs), and laser diodes that could demonstrate generating electricity from waste heat; and
-- potential applications of using electricity converted from dissipated heat in chips and microsystems. This project is separate from a similar program (DARPA-SN-25-69) called the Microsystem Electricity Generation project, which seeks to develop technologies for microsystem packages that can capture waste heat and reclaim it as useful electricity.
Commercial and defense microelectronics generate waste heat, which today is transported through pathways to a heat sink and rejected into the atmosphere, DARPA researchers explain.
If this heat were to be gathered and transported from its source to an embedded reclamation device, the recovered electricity has the potential to transform commercial microsystem technology and power infrastructure.
From industry, DARPA would like companies to suggest chips, substrates, and microsystems for a potential DARPA program; technical IP information; and possible applications of using electricity converted from dissipated heat.
Where to send responses
Companies interested should email unclassified responses no later than 26 May 2025 to DARPA at [email protected]. Those submitting promising ideas may be asked to discuss them further.
Email questions or concerns to DARPA at DARPA-SN-25-70. More information is online at https://sam.gov/opp/86339ee41c844ea396f0e2398ba2a60e/view.
John Keller | Editor-in-Chief
John Keller is the Editor-in-Chief, Military & Aerospace Electronics Magazine--provides extensive coverage and analysis of enabling electronics and optoelectronic technologies in military, space and commercial aviation applications. John has been a member of the Military & Aerospace Electronics staff since 1989 and chief editor since 1995.
