Indium Corporation introduces Indium12.9HF solder paste for fine-feature electronics assembly

The material is formulated to deliver high stencil print transfer efficiency across a wide range of process conditions, helping improve solder paste inspection (SPI) yields in high-density board designs.
April 8, 2026
2 min read
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CLINTON, N.Y. - Indium Corporation in Clinton, N.Y., has introduced its Indium12.9HF no-clean, halogen-free solder paste designed for fine-feature electronics assembly and semiconductor packaging applications.

Indium12.9HF is engineered to support fine-feature printing for advanced component sizes, including 01005 and 008004 packages. The material is formulated to deliver high stencil print transfer efficiency across a wide range of process conditions, helping improve solder paste inspection (SPI) yields in high-density board designs.

The solder paste is designed to provide low voiding performance on common surface finishes such as organic solderability preservative (OSP) and electroless nickel immersion gold (ENIG), improving thermal management and long-term reliability. It also demonstrates high oxidation resistance during reflow, with little to no graping or solder balling on pads as small as 175 microns.

Indium12.9HF supports a range of Pb-free solder alloys and powder types, including Type 5-MC as a standard offering, with compatibility for other powder sizes depending on application requirements. The material meets IPC J-STD-004B classification ROL0 and conforms to J-STD-005A requirements, while maintaining halogen-free compliance per IEC 61249-2-21.

Indium12.9HF is designed for no-clean processing, though residues can be removed if required using standard flux cleaning materials. The solder paste is available in multiple packaging formats, including 500-gram jars and 600-gram cartridges, with additional configurations for enclosed print head systems. Refrigerated storage below 10 degrees Celsius is recommended to maintain a typical shelf life of up to six months.

The company also recommends complementary materials for rework, wave soldering, and other processes, including TACFlux 089HFT and 020B-RC fluxes, CW-807 cored wire, and WF-9945 and WF-9958 wave fluxes.

For more information, please visit https://www.indium.com.