Thermal management and power control developed for ultra-high-speed imaging sensor for ballistics research
Summary points:
- Kirana video camera images at speeds to 7 million full-resolution images per second for detailed analysis in extreme high-speed environments.
- A custom aluminum nitride ceramic package ensures efficient heat dissipation for stable operation.
- Camera is for demanding scientific and industrial uses like ballistics, combustion research, fracture mechanics, and biological imaging.
CAMBRIDGE, England – SI Sensors in Cambridge, England, is collaborating with ESCATEC Switzerland AG in Balgach, Switzerland, to develop assembly processes for the ultra-high-speed imaging sensor in the Kirana high-speed video camera from Specialised Imaging Ltd in Pitstone, England.
Collecting high-resolution data at millions of frames per second, the Kirana imaging sensor chip dissipates significant power, which requires careful thermal management.
"To overcome this challenge we developed a novel aluminum nitride ceramic package that offers high thermal conductivity and closely matches the coefficient of thermal expansion of the silicon imaging sensor," explains Phil Brown, general manager of SI Sensors. "This unique packaging provides efficient heat extraction from the imaging sensor die and enables a wide operating temperature range."
High-resolution imaging
The Kirana high-speed video camera combines the flexibility of a video camera with the speed and resolution approaching those only available with framing cameras. The offers 180 images at capture speeds as fast as 7 million images per second at full resolution.
The Kirana camera is for ballistics, detonics, digital image correlation, combustion research, biological/microscopic, fracture mechanics, cavitation and multiphase flow, materials research testing, and schlieren imaging.
For more information contact SI Sensors online at https://si-sensors.com; ESCATEC at https://www.escatec.com; or Specialised Imaging at https://specialised-imaging.com.
