Manufacturers of long-lifecycle systems face supply chain challenges due to the rapid obsolescence of components, especially for devices with older date codes.
Despite the growing consensus that date code restrictions are unfounded, some OEMs and CMs continue to express concerns about soldering aged material onto printed circuit boards.
Rochester Electronics presents its findings on the effectiveness of board attachment compared to traditional solderability tests for surface mount devices after extended storage periods, as specified in the EIA/IPC/JEDEC joint standard J-STD-002.
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