ACT designers consider embedded heat pipes to enhance cooling in high-power VPX cards

BALTIMORE, 1 May 2013. Electronics thermal management experts at Advanced Cooling Technologies Inc. (ACT) in Lancaster, Pa., have devised a new cooling technique for high-power VPX embedded computing cards that involves embedded heat pipes to enhance heat removal from computer boards.

ACT officials are cautiously approaching industry with their embedded-heat-pipe technology called Dual-Sided Condenser, which uses heat pipes to move heat from away from the VPX card frame to dissipate via the electronics enclosure.

ACT thermal-management engineers are talking about the Dual-Sided Condenser technology this week at the 2013 SPIE Defense Security + Sensing conference and trade show in Baltimore.

A typical conduction-cooled VPX module moves 70 percent of its heat away from components on the board through the metal card frame, and about 30 percent of its heat through the card wedge lock, which contacts directly with the enclosure wall, explains Bryan Muzyka, sales engineer at ACT.

The company's Dual-Sided Condenser technology, however, offers to balance that heat dissipation to 50 percent from the card frame and 50 percent from the wedge lock, Muzyka says.

Dual-Sided Condenser technology channels heat through heat pipes embedded in the cared frame directly to the wedge lock to enhance how well the wedge lock removes heat, he says.

Although Dual-Sided Condenser technology can make big improvements to electronics heat removal, this approach comes at a price. It can increase the cost of the card frame by about three times, so systems designers must factor the increased cost into their design tradeoff analysis.

For high-performance embedded computing (HPEC) and some high-power RF and microwave applications, however, the increased cost of the Dual-Sided Condenser technology might be worth it.

Systems designers today are struggling to conduction cool embedded systems that call for ever-increasing amounts of power for advanced processors like the Intel Core i7 microprocessor, high-end field-programmable gate arrays (FPGAs), and general-purpose graphics processing units (GPGPUs).

Dual-Sided Condenser technology does not increase the size of the card frame, and adds only miniscule weight to the assembly, Muzyka says. Typically the company will retrofit card frames with the embedded heat pipes to avoid adding bulk, he says.

Typical military embedded computing applications would include radar signal processing, avionics electronics boxes, and RF and microwave systems, he says.

For more information contact Advanced Cooling Technologies online at www.1-act.com.


Get All the Military Aerospace Electronics News Delivered to Your Inbox or Your Mailbox

Subscribe to Military Aerospace Electronics Magazine or email newsletter today at no cost and receive the latest information on:


  • C4ISR
  • Cyber Security
  • Embedded Computing
  • Unmanned Vehicles

Military & Aerospace Photos

Most Popular Articles

Related Products

XPedite7501 | 5th Generation Intel® Core™ i7 Broadwell-H Processor-Based Conduction- or Air-Cooled XMC Module

The XPedite7501 is a high-performance, low-power, XMC module based on the 5th generation Intel® C...

XCalibur4501 | 5th Generation Intel® Core™ i7 Broadwell-H Processor-Based Conduction-Cooled 6U CompactPCI Module

The XCalibur4501 is a high-performance 6U CompactPCI single board computer that is ideal for rugg...

XPedite7530 | 5th Generation Intel® Core™ i7 Broadwell-H Processor-Based Conduction- or Air-Cooled 3U CompactPCI Module

The XPedite7530 is a high-performance 3U CompactPCI single board computer that is ideal for rugge...

XCalibur4540 | 5th Generation Intel® Core™ i7 Broadwell-H Processor-Based Conduction- or Air-Cooled 6U VPX Module

The XCalibur4540 is a high-performance, 6U OpenVPX™, multiprocessing, single board computer that ...

XPedite7570 | 5th Generation Intel® Core™ i7 Broadwell-H Processor-Based Conduction- or Air-Cooled 3U VPX-REDI Module

The XPedite7570 is a high-performance, 3U VPX-REDI, single board computer based on the 5th genera...

XPedite7572 | 5th Gen Intel® Core™ i7 Broadwell-H Based Conduction- or Air-Cooled 3U VPX-REDI Module with SecureCOTS™

The XPedite7572 is a secure and high-performance, 3U VPX-REDI, single board computer based on the...

XCalibur4500 | 5th Generation Intel® Core™ i7 Broadwell-H Processor-Based Conduction- or Air-Cooled 6U CompactPCI Module

The XCalibur4500 is a high-performance 6U CompactPCI single board computer that is ideal for rugg...

Medusa VPX3424

The AcQ Inducom “Medusa”VPX3424 is a 3U OpenVPX™ Single Board Computer (SBC) featuring the T4240 ...

XPand6200 Series | Small Form Factor (SFF) Sub-½ ATR Rugged COTS System utilizing 3U VPX, XMC, and PMC Modules

The XPand6200 Series is a true Commercial-Off-The-Shelf (COTS) Rugged system, supporting many 3U ...

XPedite2470 | 3U VPX Xilinx Virtex-7 FPGA Module with FMC Site and Freescale P1010 Processor

The XPedite2470 is a high-performance, reconfigurable, conduction- or air-cooled, 3U VPX, FPGA pr...

Related Companies

Stealth.com

Manufactures industrial rugged computers and peripherals, including custom rack servers, rugged LCD monitors, mini PC...

AcQ Inducom

Develops and produces non-certified and certified high-tech modular hardware- and software solutions for on-board and...

Master Bond

For over 35 years, Master Bond has been supplying aerospace and defense manufacturers with custom formulated compound...

United Electronic Industries Inc

UEI is a leader in the PC/Ethernet data acquisition and control, Data Logger/Recorder and Programmable Automation Con...

Intersil

Specializes in the design and manufacture of high performance analog semiconductors, Products include amplifiers, ana...

Innovative Integration

  Since 1988, Innovative Integration has grown to become one of the world's leading suppliers of DSP and data ac...

Active Silicon Inc

Designs and manufactures frame grabbers and embedded vision systems in PCI express, PCI/104-express, PMC, cPCI and C...

North Atlantic Industries Inc

The top 10 defense companies worldwide rely  on NAI Solutions NAI is a leading independent provider of specializ...

Electronic Development Labs Inc (EDL)

Since 1943, EDL has strived to provide quality products, outstanding customer service, and superior technical support...

MPL AG

MPL AG develops and manufactures rugged embedded computers and ethernet solutions with high quality standards. The su...
Wire News provided by   

Press Releases

Model INCX-4001

The INCX-4001 consists of a high quality audio transceiver specifically designed to implement a complete fiber optic intercom.

Model PS-1210

The PS-1210 is a 1A, 12VDC stand-alone or rack mountable non-switcher (no RF noise) power supply.

Model OS-3121

Optical switches are utilized to disconnect, bypass and reroute fiber optic communications. All of these optical switches are purely optical path, there is no optical to e...

Webcasts

New Design Tools That Help You Develop Radar That Sees the Un-seeable and Detects the Undetectable

Xilinx EW/ISR System Architect, Luke Miller, has new tricks and he’s going to tell you all about them in a new Xilinx Webinar—for free. His Webinar will cover new ways to implement Radar functions including ...
Sponsored by:

The Latest from Paris Air Show 2015

All Access Sponsors


Mil & Aero Magazine

May 2015
Volume 26, Issue 5
file

Download Our Apps



iPhone

iPad

Android

Follow Us On...



Newsletters

Military & Aerospace Electronics

Weekly newsletter covering technical content, breaking news and product information
SUBSCRIBE

Cyber Security

Monthly newsletter covering cyber warfare, cyber security, information warfare, and information security technologies, products, contracts, and procurement opportunities
SUBSCRIBE

Defense Executive

Monthly newsletter covering business news and strategic insights for executive managers
SUBSCRIBE

Electronic Warfare

Quarterly newsletter covering technologies and applications in electronic warfare, cyber warfare, optical warfare, and spectrum warfare.
SUBSCRIBE

Embedded Computing Report

Monthly newsletter covering news on embedded computing in aerospace, defense and industrial-rugged applications
SUBSCRIBE

Unmanned Vehicles

Monthly newsletter covering news updates for designers of unmanned vehicles
SUBSCRIBE