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    • TEWS Technologies GmbH

    Halstenbek D-25469

    COMPANY OVERVIEW

    About TEWS Technologies GmbH

    50

    Contact

    Am Bahnhof 7
    Halstenbek D-25469
    Germany
    https://www.tews.com
    49-4101-4058-0

    More Info on TEWS Technologies GmbH

    TEWS Technologies GmbH is a leading manufacturer of embedded I/O solutions based on the XMC, PMC, mPCIe, PCI Express, PCI, cPCI-Serial, compactPCI, AMC and FMC industrial standards. TEWS Technologies offers its boards with a standard warranty of five years. Software Support for Windows, VxWorks, Linux, Integrity and QNX are available off-the-shelf.

    Products

    FPGA boards

    TPMC632

    PMC module providing user configurable XC6SLX45T-2 or XC6SLX100T-2 Spartan-6 FPGA, Flash device is programmable via JTAG and in-system programmable, Operating temperature -40°...
    Data-acquisition boards

    TPMC554

    32 channels of 16 bit D/A conversion, Input voltage software programmable per channel, FIFOs allow waveform / pattern generation, Support of individual/simultaneous channel update...
    Communications/network controllers

    TPCE863

    FPGA based DMA supported Sync/Async Serial Communication Controller, Maximum data rates up to 10 Mbit/s, Physical interface programmable per channel, Operating temperature -40...
    Communications/network controllers

    TXMC375

    Conduction Cooled XMC; 8 channels of high performance programmable RS232/RS422/RS485 serial interface
    Mezzanine/daughter boards

    TPCE275

    PCI Express XMC Carrier, VPWR: 5V or +12V; JTAG Header; Pericom PI2EQX4401D; PCIe ReDriver; XMC J14 I/O and J16 I/O; Operating temperature: 0°C to +70°C

    Press Releases

    Tmpe863
    I/O boards

    TEWS Technologies Extends mPCIe Module Family Into Communications with FPGA-Based 3 Channel High Speed Synch/Asynch Serial Interface

    TEWS extends its tradition of delivering high-density I/O solutions with the introduction of a synchronous/asynchronous standard full PCI Express Mini Card module with three high...

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