Rugged enclosures for aerospace, defense, and similar applications introduced by ADL

SAN DIEGO, 21 July 2014. ADL Embedded Solutions in San Diego is introducing the ADLMES-8200 family of high IP modular electronics enclosures for military, aerospace, and other embedded computing applications that must operate in rugged conditions like aviation and aerospace.

The ADLMES-8200 is a configurable, modular enclosure system aimed at quick-turn delivery of rugged or extended-temperature enclosures for a variety of applications.

The modular sidewall design supports variable PC/104 stack heights, the ADL Embedded Solutions 3.5-inch single-board computers and other single-board computer intelligent systems.

The ADLMES-8200 is available in 3 different variations: the ADLMES-8200-LP low profile 2-card chassis, which measures 3.2 by 7 by 6.6 inches; the ADLMES-8200-P1 4-card chassis that measures 4.6 by 7 by 6.6 inches; and the ADLMES-8200-P2 6-card chassis that measures 5.9 by 7 by 6.6 inches.

The finned-chassis design allows for conduction cooling through the base to airframe or vehicle bulkhead or passive cooling via the finned chassis surface which can be augmented with forced cooling. Up to IP65 ingress-protection is possible with faceplate and connector options.

The ADLMES-8200 is only available as part of a system. Full quick-turn system solutions including internal hardware is made possible through the ADL Embedded Solutions PC/104 single-board computer options ranging from low-power Intel Atom(Z510/Z530, D525 Pineview and N2600 Cedarview) to high-performance 4th generation Intel Core i7 Quad processors like the ADLQM87PC.

Compatible power supply options (ADLPS35, ADLPS104 & ADLPS104ISO) are available for simple and high-powered systems as well as a broad range of peripheral options.

For more information contact ADL Embedded Solutions online at http://adl-usa.com.