Small cable assemblies for high-speed artificial intelligence (AI) and data centers introduced by Samtec
NEW ALBANY, Ind. – Samtec Inc. in New Albany, Ind., is introducing Si-Fly LP low-profile cable assemblies for high-performance computing, high-speed data centers and artificial intelligence (AI) applications.
The extremely low 4.35-millimeter mated height of Si-Fly LP cable-to-board assemblies enable side-to-side, front-to-back, or belly-to-belly printed circuit board mounting near the IC package, with secure placement under heat sinks or other cooling hardware where z-axis height is limited.
Each high-speed Si-Fly LP cable assembly provides 112-gigabit-per-second PAM4 channel rate in a 2-row, 16-pair design with aggregate data rates of 896-gigabit-per-second (x8 bi-directional) or 1.79-terabit-per-second (x16 uni-directional) and is PCI Express-6.0/CXL 3.2 capable.
Thermal management
Routing signals from the chip through high-density, high-performance flyover cable reduces thermal vulnerabilities, simplifies board layout, improves overall cost by eliminating expensive re-timers, and enables fewer board layers and less expensive printed circuit board materials.
Si-Fly LP cable assemblies feature Samtec's proprietary 34 American Wire Gauge (AWG) 92 Ohm ultra-low-skew eye speed twinax cable. Samtec works with systems architects early to create solutions for cable management and thermal load distribution.
For more information contact Samtec online at https://www.samtec.com/high-speed-cable/flyover/si-fly/.
