Embedded computing for artificial intelligence (AI) and edge computing in harsh environments from Kontron

April 6, 2022
The COMh-sdID features Xeon D-2700 processors, and scalability from four to 20 cores for extended temperature ranges and continuous operation.

ISMANING, Germany – Kontron AG in Ismaning, Germany, is introducing the COMh-sdID COM-HPC server module for artificial intelligence (AI) applications, high-performance network platforms, and edge servers that must operate in harsh environments and extreme conditions.

The COMh-sdID features the Xeon D-2700 processors, and offers scalability from four to 20 cores and SKUs for an extended temperature range and continuous operation for as long as 10 years of reliable service.

The embedded computing module accommodates 4x DIMM sockets for a maximum of 512 gigabytes of DDR4 memory at 3200 megatransfers per second. As storage medium, a soldered NVMe solid-state drive onboard with as much as 1 terabyte of data storage capacity is an option.

With 48x PCI Express lanes and 2x Quad LAN interfaces supporting throughput as fast as 100 Gigabit Ethernet, the COMh-sdID is for high data throughput requirements in demanding I/O and network structures in harsh environments.

The Kontron COMh-server eval carrier offers standard interfaces like USB and SATA, as well as 8x SFP28 Ethernet interfaces. The Kontron COMh-sdID module and Kontron COMh-Server Eval Carrier will be available in summer 2022.

For more information contact Kontron AG online at www.kontron.com.

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