SAN DIEGO – Congatec Inc. in San Diego is introducing COM-HPC and COM Express computers-on-modules to help secure investments in existing OEM designs, which includes upgrade options for more data throughput from PCI Express Gen4 support.
The integrated Intel Iris Xe graphics architecture is suited for enhanced graphics demands such as those found in video streaming and video data based situational awareness applications.
These embedded computing modules also are for industrial, medical, artificial intelligence (AI) and machine learning applications, as well as all types of embedded and edge computing with workload consolidation.
The modules are based on high-end 13th Gen Intel Core processors in BGA assembly. With Thunderbolt and enhanced PCI Express support as much as Gen5, the modules based on the COM-HPC standard open up horizons for developers in data throughput, I/O bandwidth and performance density.
The COM Express 3.1-compliant modules provide as much as 8 percent single thread and as much as 5 percent multithread performance gains from the soldered 13th Gen Intel Core processors compared to 12th Gen Intel Core processors.
High power efficiency is due to an enhanced manufacturing process. Also in this 15-to-45-Watt base power class are DDR5 memory support and PCI Express Gen5 connectivity.
For more information contact Congatec online at www.congatec.com.
