Microelectronics design and manufacturing for 3D microsystems highlight DARPA ERI 2.0 summit in Seattle

May 19, 2023
ERI 2.0 seeks to ensure U.S. leadership in next-generation microelectronics research and manufacturing for aerospace and defense 3D microsystems.

ARLINGTON, Va. – U.S. military researchers will discuss cutting-edge research for the future of U.S. microelectronics design and manufacturing in military electronics on 22 to 24 Aug. 2023 at the Hyatt Regency, 808 Howell St., in Seattle.

The U.S. Defense Advanced Research Projects Agency (DARPA) in Arlington, Va., is hosting the Electronics Resurgence Initiative (ERI) Summit, which convenes top microelectronics and semiconductors experts on the theme of Reinventing Domestic Microelectronics Manufacturing.

Microsystems leaders from government, industry, and academia will explore pressing issues and advances in microelectronics innovation at the summit, which focus on DARPA's Electronics Resurgence Initiative (ERI) 2.0 to advance manufacturing for complex 3D microsystems and hardened electronics for extreme environments.

ERI 2.0 seeks to ensure U.S. leadership in next-generation microelectronics research and manufacturing. The initiative aims at national security and commercial microelectronics applications with partnerships among the U.S. Department of Defense, industry, and universities.

Related: DARPA chooses Teledyne to design advanced RF and microwave MMICs for communications and sensing at G-band

ERI 2.0 seeks to reinvent domestic microelectronics manufacturing using three-dimensional heterogeneously integrated (3DHI) manufacturing, and research in manufacturing complex 3D microsystems. The initiative emphasizes design, test, and prototyping of complex circuits; increasing information processing density and efficiency; accelerating innovation in artificial intelligence (AI) hardware to make fast decisions at the edge and securing communications.

Speakers at the ERI summit include U.S. Sen. Maria Cantwell, D-Wash., who chairs the Senate Committee on Commerce, Science, and Transportation; Stephen Welby, deputy director for national security of the White House Office of Science and Technology Policy; Heidi Shyu, U.S. under secretary of defense for research and engineering; Stefanie Tompkins, director of DARPA; Pat Gelsinger, CEO of Intel Corp. in Santa Clara, Calif.; Bill Dally, chief scientist and senior vice president of research at NVIDIA Corp. in Santa Clara, Calif.; and Mark Papermaster, vice president and chief technology officer of Advanced Micro Devices (AMD) in Santa Clara, Calif.

The 2023 ERI 2.0 Summit website is at https://eri-summit.darpa.mil. Those interested should register no later than 31 July 2023 online at https://eri-summit.darpa.mil. No onsite registration is available. Email questions or concerns to DARPA at [email protected]. More information is online at https://sam.gov/opp/da41500cc8624dff82f56d0944132a7a/view.

About the Author

John Keller | Editor-in-Chief

John Keller is the Editor-in-Chief, Military & Aerospace Electronics Magazine--provides extensive coverage and analysis of enabling electronics and optoelectronic technologies in military, space and commercial aviation applications. John has been a member of the Military & Aerospace Electronics staff since 1989 and chief editor since 1995.

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