Georgia Tech announces packaging innovations

Experts at the Packaging Research Center of the Georgia Institute of Technology in Atlanta, are reporting on 10 technical innovations they developed over the past year. The center, which has funding from several U.S. government agencies, is in place to develop the next generation of semiconductor packaging technologies beyond those under industry development. The aim is to help U.S. designers build competitive electronic products and systems for aerospace, military, telecommunications, computer,

Experts at the Packaging Research Center of the Georgia Institute of Technology in Atlanta, are reporting on 10 technical innovations they developed over the past year. The center, which has funding from several U.S. government agencies, is in place to develop the next generation of semiconductor packaging technologies beyond those under industry development. The aim is to help U.S. designers build competitive electronic products and systems for aerospace, military, telecommunications, computer, medical, and consumer electronics applications. For more information, contact center director Rao Tummala by phone at 404-894-9097, by e-mail at rao.tummala@ece.gatech.edu, or on the World Wide Web at http://www.gtri.gatech.edu/. - J.K.

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