WEST CALDWELL, N.J., 21 January 2005. Merrimac Industries, Inc. today announced that it received an order valued at $1.3 million from The Boeing Company's Integrated Defense Systems, Huntington Beach, Calif., to supply Beamforming Networks and RF/ Microwave signal processing components on Boeing's GPS (Global Positioning System) IIF Satellites.
Boeing exercised its second contract option for Merrimac to provide additional signal processing components on Space Vehicles 7, 8, and 9. Under a contract awarded by the U.S. Air Force, Boeing is currently building the third group of GPS IIF satellites, with a potential total of up to 12 satellites. Today's order is part of the contract from Boeing estimated to reach $4.4 million that Merrimac announced on September 3, 2003.
Designed for flexibility and growth, the IIF satellites will provide new capabilities, including improved anti-jam, increased accuracy, higher integrity, and critical secure Operational Military codes.
"Merrimac continues to be a strategic supplier to The Boeing Company on the U.S. Air Force GPS Block IIF, Satellite Program and we look forward to continuing our assembly of the next three satellites in 2005, with a potential for up to three additional Boeing IIF satellites through 2006," said Merrimac Chairman and CEO Mason N. Carter.
"Our process and management teams continue to work very closely with Boeing in meeting and exceeding Boeing's expectations. We look forward to continuing to work with Boeing through the completion of this important navigation satellite program."
Merrimac Industries, Inc. is a leader in the design and manufacture of Multi-Mix PICO RF Microwave components, assemblies and micro-multifunction modules (MMFM), serving the wireless telecommunications industry worldwide with enabling technologies for space, defense and commercial applications. Merrimac is focused on providing Total Integrated Packaging Solutions with Multi-Mix Microtechnology, a leading edge competency providing value to our customers through miniaturization and integration.
The Multi-Mix process for microwave, multilayer integrated MMFM circuitry is a patented method developed by Merrimac Industries based on fluoropolymer composite substrates. The fusion bonding of multilayer structures provides a homogeneous dielectric medium for superior electrical performance at microwave frequencies. The bonded layers may incorporate embedded semiconductor devices, MMICs, etched resistors, passive circuit elements and plated-through via holes to form a three-dimensional subsystem enclosure that requires no further packaging. Merrimac Industries facilities are registered under ISO 9000, an internationally developed set of quality criteria for manufacturing operations.
Merrimac Industries, Inc. and its subsidiary Filtran Microcircuits Inc., are located in West Caldwell, N.J., San Jose, Costa Rica, and Ottawa, Ontario, and have approximately 240 co-workers dedicated to the design and manufacture of signal processing components, gold plating of high-frequency microstrip, bonded stripline and thick metal-backed Teflon (PTFE) micro- circuitry and subsystems providing Total Integrated Packaging Solutions for wireless applications. For more information, see www.merrimacind.com and www.filtranmicro.com.
