Officials of the Naval Sea Systems Command in Washington are asking Sechan for Cooperative Engagement Capability (CEC) Signal Data Processor Assemblies (SDP-S). This modification is to the established SDP-S production contract.
The Raytheon CEC can combine data from several different radar systems on the ground, on the sea, or in the air, to create a common air picture based on all sensor data available. CEC seeks to provide a situational awareness picture that is greater than the sum of its parts.
The SDP-S, meanwhile, is the core of the CEC system, and provides the processing power necessary to fuse the radar sensor tracks from several different radar systems on the ground, in the air, and at sea.
The SDP-S includes the Sierra II cryptographic chip designed by the Harris Corp. RF Communications division in Rochester, N.Y., which helps the CEC meet cryptographic modernization requirements and uses commercial-off-the-shelf components to create an open-systems architecture, Navy officials say.
CEC is designed to provide early detection and consistent tracking of enemy cruise missiles, manned aircraft, and unmanned aerial vehicles, and is based on a high-bandwidth military communications system with electronic countermeasures that blends in the global positioning system (GPS).
The SDP-S assemblies are used on CEC shipboard, airborne, and land mobile platforms to provide a composite network picture. The contract combines purchases for the U.S. Navy, Marine Corps., and the government of Japan.
story continues below
On this contract modification Sechan will do the work in Lititz, Pa., and should be finished by July 2017. For more information contact Sechan Electronics online at www.sechan.com, or Naval Sea Systems Command at www.navsea.navy.mil.
Learn more: search the Aerospace & Defense Buyer's Guide for companies, new products, press releases, and videos