This chassis is designed to provide cooling for high-performance modules like Xilinx Virtex-7 FPGA, multicore Intel Core i7, and GPGPU-based VPX single board computers and DSP engines that can dissipate heat in the 120-to-200-Watt range.
Capitalizing on Curtiss-Wright's air-flow-through subsystem technology, the AFT16 supports the ANSI/VITA 48.5 air-flow-through standard with the Northrop Grumman patented air-flow-through technology.
The 16-slot chassis supports 16 ANSI/VITA 48.5 6U air-flow-through slots with 13 slots of 1.5-inch pitch for air-flow-through OpenVPX cards and three slots for power supplies for to 2,370 Watts of power.
Northrop Grumman's air-flow-through technology improves the air cooling of advanced electronic modules with a compact core style heat exchanger design that increases the cooling efficiency of removable electronic modules such as VPX (VITA 46/48) cards.
Air-flow-through modules are housed in rugged, sealed shells that enable cooling without directly exposing a module's electronics to direct contact with air, eliminating the risk of exposure to airborne contaminants.
Air-flow-through technology employs sliding air seals at the inlet and outlet of cards, and enables modules to be removed and replaced in the field without requiring specialized technicians or the removal of the entire subsystem to ensure safe module replacement or technology upgrades.
For more information contact Curtiss-Wright Defense Solutions online at www.cwcdefense.com.