VPX XMC carrier board for FPGA processing in rugged systems introduced by GE Fanuc

CHARLOTTESVILLE, Va., 2 Sept. 2009. GE Fanuc Intelligent Platforms in Charlottesville, Va., is introducing the PEX441 rugged 6U VPX XMC carrier card for military and aerospace applications in system I/O, FPGA processing, graphics, and signal conversion interfaces.

CHARLOTTESVILLE, Va., 2 Sept. 2009. GE Fanuc Intelligent Platforms in Charlottesville, Va., is introducing the PEX441 rugged 6U VPXXMCcarrier card for military, aerospace, and rugged systems applications in system I/O, FPGA processing, graphics, and signal conversion interfaces.

Designed to enable system architects and integrators to include a broad range of high performance XMCs in their designs, the PEX441 VPXcarrier board is optimized for thermal management, with the capability to enable power densities as strong as 30 Watts per XMC.

The PEX441 is part of a GE Fanuc 6U VPX product family that includes the SBC610 and SBC620 single board computers, the DSP230 quad processor and AXIS, the Advanced Multiprocessor Integrated Software development environment. For systems that require PMC and XMC support GE Fanuc offers the PEX440 which includes an on-board PCIe switch architecture with connection to the primary fabric plane.

"High performance mezzanine cards are becoming increasingly prevalent as designers look to create sophisticated systems that are extremely functionality-dense," says Peter Cavill, general manager of military & aerospace products at GE Fanuc Intelligent Platforms.

The PEX441 is available in five build levels -- benign environments through harsh-environment rugged systems.

the PEX441 enables system designers to migrate their XMC laboratory systems to a rugged, deployable 6U VPX form factor to exploit the complement of high speed digital I/O available through a standard VPX backplane.

It extends the functional envelope of a 6U VPX system by capitalizing on an array of GE Fanuc- or customer proprietary XMC modules into a distributed, fabric-based architecture, removing the need to host high power mezzanines on high power CPU cards. Thermal load can be spread across several system slots for both air- and conduction cooled applications supporting high compute density.

For more information contact GE Fanuc online at www.gefanucembedded.com.

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