Pixus OpenVPX chassis helps users test air- and conduction-cooled boards in the same enclosure

WATERLOO, Ontario – Pixus Technologies in Waterloo, Ontario, is introducing the Pixus OpenVPX development chassis for embedded computing design, with a mix of card guides that enable users to test IEEE 1101.10 air-cooled and IEEE 1101.2 conduction-cooled boards in the same enclosure.

By Mil & Aero staff
By Mil & Aero staff

WATERLOO, Ontario – Pixus Technologies in Waterloo, Ontario, is introducing the Pixus OpenVPX development chassis for embedded computing design, with a mix of card guides that enable users to test IEEE 1101.10 air-cooled and IEEE 1101.2 conduction-cooled boards in the same enclosure.

The chassis enables the use of rear transition modules (RTMs) and as many as eight backplane slots at a 1-inch pitch. The open-frame design provides a way to attach probes and access the plug-in boards.

Pixus offers various slot sizes and profiles of 3U and 6U OpenVPX backplanes compliant to the VITA 65 specification.

A modular power supply enables designers to assemble various modules for 3.3-, 5-, and plus-or-minus 12-volt auxiliary voltages, and other options for the ideal power output for each configuration.

Related: 4U OpenVPX chassis for developing 3U VPX and OpenVPX embedded computing cards offered by Pixus

Pixus has developed specialty card guides, threaded inserts, and front and filler panels for the half-HP offset spacing of the architecture for a precision fit and alignment. The company has also developed an ultra-rugged rail to prevent bowing or cracking due to high-insertion forces of 6U OpenVPX designs.

Pixus offers OpenVPX chassis in 19-inch rackmount, development/desktop, air transport rack (ATR), and ruggedized versions. The company also provides components, chassis platforms, and modular instrumentation cases in various form factors.

For more information contact Pixus Technologies online at www.pixustechnologies.com.

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