SAN DIEGO – Congatec Inc. in San Diego is introducing a Micro-ATX server carrier board and COM-HPC servers on module based on the Intel Xeon D Ice Lake processors for a wide range of embedded computing applications.
The Micro-ATX server board is for compact real-time servers in critical infrastructure. The board can scale with high-end COM-HPC server modules from Congatec to form a ready-to-use Micro-ATX platform for applications with high performance requirements in space-saving designs.
The Micro-ATX carrier board for COM-HPC servers on module offers several customization options at module, board, and system level for edge computing and industrial applications.
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The Micro-ATX carrier board conga-HPC/Micro-ATX server is for applications, such as consolidating servers for virtual machines or edge servers for energy micro grids, video processing, facial recognition, security applications, and smart city infrastructures.
The conga-HPC/Micro-ATX server offers communication options with bandwidth as fast as 100 Gigabit Ethernet; x8 and x16 PCI Express expansion for processing AI-intensive workloads via general-purpose graphics processing units (GPGPUs) or other compute accelerators; 2x M.2 Key M slots for NVMe solid-state drives; and a M.2 Key B slot for compact AI accelerators or communication modules for WiFi or LTE/5G.
The conga-HPC/sILL and conga-HPC/sILH servers on module use the Intel Ice Lake D-1800 LCC and D-2800 HCC processors. The improved performance per Watt of the COM-HPC modules is for high-temperature applications, and offer Intel Speed Select technology. The latest processors have as many as 22 cores.
For more information contact Congatec online at www.congatec.com.
