McCLELLAN, Calif. – U.S. military microelectronics experts are working with 13 U.S. defense contractors to develop advanced microcircuits and mitigate electronics obsolescence under terms of a potential 10-year contract worth as much as $24.5 billion.
Officials of the U.S. Defense Microelectronics Activity (DMEA) in McClellan, Calif., announced the companies on Friday and in late December who will participate in the Advanced Technology Support Program V (ATSP V).
The program seeks to develop electronics hardware and software to support military needs such as rapid prototyping, systems integration, testing, and limited production to address obsolescence and emerging electronic threats.
Companies chosen
The 13 companies that will share as much as $24.5 billion over the next decade are:
-- BAE Systems Electronics Systems segment in Nashua, N.H.;
-- Battelle Memorial Institute in Columbus, Ohio;
-- Boeing Defense, Space & Security in St. Louis;
-- Charles Stark Draper Laboratory Inc. in Cambridge, Mass.;
-- Leonardo DRS in Melbourne, Fla.;
-- General Dynamics Mission Systems Inc. in Taunton, Mass.;
-- HII Mission Technologies Corp. in McLean, Va.;
-- L3Harris Technologies Inc. in Palm Bay, Fla.;
-- Leidos Inc. in Reston, Va.;
-- Paste link hereLockheed Martin Rotary and Mission Systems in Owego, N.Y.;
-- Northrop Grumman Mission Systems in Linthicum Heights, Md.;
-- RTX Corp. Raytheon segment in El Segundo, Calif.; and
-- Vertex Aerospace LLC in Madison, Miss.
Military microelectronics
ATSP V is an engineering development and transition program that capitalizes advanced technologies to meet military and U.S. government needs for rapid microelectronics acquisition, development, and deployment.
This includes developing components for microelectronics in ultra-low volumes; extending component availability; ensuring a trusted, assured, and secure supply of microelectronics; intelligent and rapid application of advanced technologies in new applications; adding performance enhancements to government systems; and deal with the electronics obsolescence problems of aging systems.
Reliability, maintainability, and obsolescence management will come from developing components for advanced technologies applications. ATSP V includes using modern or legacy technologies.
The job covers hardware and software, and includes studies; analysis; design; software; simulation; fabrication; prototyping; integration; testing; producibility; extended limited production; procedures for using available tools; replacement issues; and technical interchanges.
On this contract, the chosen companies will do the work at locations to be determined with each order, and should be finished by January 2036. For more information contact the Defense Microelectronics Activity online at www.acq.osd.mil/asds/dmea/atsp.html.
