Embedded computing standard for rugged, conduction-cooled MicroTCA systems announced by PICMG
WAKEFIELD, Mass., 8 March 2011. The PCI Industrial Computer Manufacturers Group (PICMG) in Wakefield, Mass., is announcing ratification of a new standard that defines rugged, conduction-cooled electronic circuit boards that adhere to the Micro Telecom Computing Architecture (MicroTCA) architecture. The PICMG Hardened Conduction Cooled MicroTCA (MicroTCA.3) specification defines the requirements for systems that meet demanding levels of temperature, shock, vibration, and other environmental conditions for rugged MicroTCA systems in military, shipboard, outdoor telecommunications, and other harsh mobile equipment environments.
PICMG's MicroTCA specification was adopted in 2006 and enables AdvancedMC products to function in a passive backplane architecture. By reusing AdvancedMC products, MicroTCA systems are much smaller than classic AdvancedTCA architectures. This new specification enables deployments in a wide variety of harsher environments than possible before this latest adoption.
For more information contact PICMG online at www.picmg.org.