DARPA schedules industry day for PowerDAC RF and microwave research project for 25 Jan. in Arlington, Va.

ARLINGTON, Va., 16 Jan. 2011. The U.S. Defense Advanced Research Projects Agency (DARPA) in Arlington, Va., is sponsoring an industry day on 25 Jan. 2011 to brief industry on the Direct Digital to High Power Analog Conversion Technology (PowerDAC) program to find ways of combining digital-to-analog (D/A) converter and high-power amplifier technology in one device to create a new frontier of power efficiency for electronic warfare, radar, and military communications systems.

Jan 16th, 2011
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ARLINGTON, Va., 16 Jan. 2011. The U.S. Defense Advanced Research Projects Agency (DARPA) in Arlington, Va., is sponsoring an industry day on 25 Jan. 2011 to brief industry on the Direct Digital to High Power Analog Conversion Technology (PowerDAC) program to find ways of combining digital-to-analog (D/A) converter and high-power amplifier technology in one device to create a new frontier of power efficiency for electronic warfare, radar, and military communications systems.

The proposer's day for the PowerDAC project, which will be located in the Arlington, Va., area, is to provide potential proposers information on the PowerDAC program, promote additional discussion on this topic, address questions, provide a forum to present their capabilities, and to encourage team formation.

To register, and for more information on the PowerDAC industry day, contact PowerDAC Program Manager Daniel Purdy by e-mail at DARPA-BAA-11-12@darpa.mil, or by phone at phone at 703-248-8070. Interested proposers are not required to attend the Proposer’s Day to respond to the PowerDAC broad agency announcement.

Material presented at the meeting including answers to selected questions, will be posted on Dr. Daniel Purdy’s DARPA Website at www.darpa.mil/mto/personnel/purdy_d.html.

The DARPA PowerDAC project seeks to combine D/A converter and high-power amplification into one component to achieve simultaneous high power, large bandwidth, high efficiency, and high linearity at RF and microwave frequencies. The idea is to create new transmitter architectures that will be scalable in power, operational frequency, and bandwidth, based on many fast silicon or silicon-germanium.

The proposers day will have two sessions: an unclassified session to discuss the project and to answer unclassified sessions; and a classified session to discuss the secret portions of the program. Proposers wishing to attend the classified session must send their security clearances as part of their registration.

Register no later than 20 Jan. 2011. Companies will be accepted on first-come, first-served basis. To receive registration materials, send an e-mail with complete contact information to DARPA-BAA-11-12@darpa.mil, subject line “PowerDAC Proposer’s Day.”

More information is online at http://www.fbodaily.com/archive/2011/01-January/15-Jan-2011/FBO-02359608.htm.

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