BAE Systems joins SAIC in program to develop DARPA Insight next-generation intelligence-analysis system

ARLINGTON, Va., 8 June 2011. Information processing experts at the BAE Systems Electronic Solutions segment in Burlington, Mass., are joining Science Applications International Corp. (SAIC) in McLean, Va., on a project to design a next-generation intelligence, surveillance, and reconnaissance (ISR) exploitation and resource management system that fills gaps in today's military intelligence analysis capability. BAE Systems won a $12.9 million contract Tuesday from the U.S. Defense Advanced Research Projects Agency (DARPA) in Arlington, Va., for the Insight intelligence analysis program.SAIC won a $14 million contract last month for the DARPA Insight program, which experts believe may help U.S. intelligence experts detect threat networks, irregular warfare, and terrorist operations by combining intelligence information from imaging sensors, crowd-source and other social network or text-based sensors, as well as from other sources for further analysis.The program seeks to fill gaps in current U.S. ISR systems involving an inability to exploit and cross-cue several different intelligence sources automatically.

Today's U.S. intelligence-analysis systems link intelligence sources to tactical operations centers manually by chat-based operator interaction, which can limit the ability to deal with fast-moving and rapidly changing threats.

The DARPA Insight program seeks to rectify this situation by integrating human and machine reasoning into intelligence equipment to blend operator knowledge and reasoning into intelligence-processing computers when dealing quickly with complex data from many different sensors.

Experts from BAE Systems Electronic Solutions and SAIC will build model-based behavioral correlation, modeling, prediction, and threat network analysis tools that combine intelligence information across many different sources automatically to improve the efficiencies of multi-intelligence sensors. The companies also will develop a unified data-management and processing environment that integrates new intelligence sensors and software algorithms.

For the DARPA Insight program, BAE Systems Electronic Solutions and SAIC also will develop the Insight Test Bed to help evaluate intelligence analysis approaches. For more information contact BAE Systems Electronic Solutions at www.baesystems.com/Businesses/ElectronicSolutions, SAIC at www.saic.com, or DARPA at www.darpa.mil.