Chip Supply changing its name to Micross Components, consolidating several facilities in Orlando

May 25, 2011
ORLANDO, Fla., 25 May 2011. Semiconductor die and packaging specialist Chip Supply Inc. in Orlando, Fla., is changing its name to Micross Components, which reflects the acquisition of Chip Supply last November by Micross Components in Los Angeles. Micross provides specialist products and services for high-reliability and state-of-the-art electronics for high-reliability, industrial, and commercial applications.
ORLANDO, Fla., 25 May 2011.Semiconductor packaging and die specialist Chip Supply Inc. in Orlando, Fla., is changing its name to Micross Components, which reflects the acquisition of Chip Supply last November by Micross Components in Los Angeles. Micross provides specialist products and services for high-reliability electronics for high-reliability, industrial, and commercial applications.Chip Supply, which provides interconnects on bare silicon from semiconductor manufacturers, chip scale packaging, and multi-chip modules has begun using the name Chip Supply Inc., doing business as Micross Components, and eventually will drop the Chip Supply name altogether, says Alan Taylor, chief executive officer of Micross.

Operations at the Chip Supply Orlando facility, which has 150 employees, five buildings, and 42,000 square feet of processing space, will continue as before the acquisition, and Orlando will become the base for all Micross die business in the United States.

Micross executives are consolidating the company's Fairfield, N.J., operations in Orlando operations out of the company's Fairfield, N.J., facility were consolidated into our Orlando campus. Eventually the company will consolidate its operations in Austin, Texas, at the Orlando site, Taylor says.

The Micross facility in Hatfield, Pa., will continue operating as the company's main U.S. site for all Micross interconnect products and component modification services, Taylor says.

The Chip Supply operations in Orlando claim to be the largest die distributor in the world, providing semiconductor interconnect, test, and assembly services. The Orlando campus has 10,000 square feet of cleanroom space in two cleanrooms, as well as wafer-processing and -encapsulation equipment for post-wafer fabrication semiconductor processing.

For more information contact Chip Supply online at www.chipsupply.com, or Micross Components at www.micross.com.

About the Author

John Keller | Editor

John Keller is editor-in-chief of Military & Aerospace Electronics magazine, which provides extensive coverage and analysis of enabling electronic and optoelectronic technologies in military, space, and commercial aviation applications. A member of the Military & Aerospace Electronics staff since the magazine's founding in 1989, Mr. Keller took over as chief editor in 1995.

Voice your opinion!

To join the conversation, and become an exclusive member of Military Aerospace, create an account today!