High-speed USB interconnect set to take center stage

May 14, 2008
SCOTTSDALE, Ariz., 14 May 2008. The year 2008 will mark the first year in which shipments of high-speed USB devices will surpass shipments of low- and full-speed USB-enabled devices, reports market researcher In-Stat in Scottsdale, Ariz.

SCOTTSDALE, Ariz., 14 May 2008. The year 2008 will mark the first year in which shipments of high-speed USB devices will surpass shipments of low- and full-speed USB-enabled devices, reports market researcher In-Stat in Scottsdale, Ariz.

The most significant development over the past year in the USB market has been the announcement of SuperSpeed USB -- the third major revision of the wired USB specification, In-Stat researchers say.

SuperSpeed is expected to deliver actual throughput of 3 gigabits per second, a rate significantly higher than high-speed USB.

"SuperSpeed USB is expected to begin shipping as discrete silicon in 2009, and broad deployment of SuperSpeed USB-enabled products is expected in 2010," says Brian O'Rourke, In-Stat analyst. "SuperSpeed USB will be targeted initially at the PC market and in devices requiring high rates and volumes of data transfer, such as external storage, CE, and communications devices with increasing amounts of storage."

Research by In-Stat found not only that more than 2.6 billion USB-enabled devices shipped in 2007, but also that annual shipment growth of USB-enabled devices through 2012 will be 8.3 percent.

The In-Stat research entitled Wired USB 2008: SuperSpeed is Coming (#IN0804102MI), covers the worldwide market for USB. It provides forecasts for USB-enabled device shipments by USB type, and for several product categories, through 2012. Profiles of USB silicon providers and analysis of recent market developments are included.

For more information on this research or to purchase it online, contact In-Stat online at www.instat.com.

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