Electronic Interconnect offers thermal management services for circuit boards

April 12, 2009
ELK GROVE VILLAGE, Ill., 12 April 2009. Electronic Interconnect Technology in Elk Grove Village, Ill., is offering thermal management printed circuit board materials for electronic assemblies requiring heat management, such as high-power electronics, RF and wireless devices, and light-emitting diode (LED) boards.

ELK GROVE VILLAGE, Ill., 12 April 2009. Electronic Interconnect Technology in Elk Grove Village, Ill., is offering thermal management printed circuit board materials for electronic assemblies requiring heat management, such as high power electronics, RF and wireless devices, and light-emitting diode (LED) boards.

Electronic Interconnect is UL certified for metal-clad circuit boards with a standard dielectric, and can work with various thicknesses of aluminum and copper metal cores, offering close machining tolerances and high-quality fabrication services for electronic thermal management.

Other constructions include two-layer T-lam, hybrid insulated metal printed circuit board (IMPCBs) with FR-4/T-preg, multilayer metal base construction, and multilayer FR-4/T-preg hybrids. The company also performs thermal analysis.

For more information contact Electronic Interconnect Technology online at www.eiconnect.com.

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