Master Bond EP17HTND-CCM is a one part epoxy that is not premixed and frozen. This black, heat curable compound has a flowable paste consistency ideal for glob top, chip coating and bonding applications. EP17HTND-CCM meets NASA low outgassing specifications and is serviceable from -80°F to +600°F [-62°C to +316°C]. It forms high strength bonds to a wide variety of similar and dissimilar substrates such as metals, ceramics, plastics, composites and various circuit board materials.EP17HTND-CCM is thermally conductive and electrically non-conductive even upon exposure to hostile environmental conditions. Formulated for various electronic applications, EP17HTND-CCM cures readily in 1-2 hours at 350°F [175°C] with a relatively low exotherm upon curing.