Adhesives, encapsulants and bondings

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Master Bond Logo 400x300b
Adhesives, encapsulants and bondings

Master Bond

Master Bond custom formulates adhesives, sealants and coatings for structural bonding and electronic applications for aerospace and defense manufacturers, for over 45 years.

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MasterSil 707FR-NV
Adhesives, encapsulants and bondings

MasterSil 707FR-NV

One component, room temperature curing, silicone elastomer
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Adhesives, encapsulants and bondings

One Component, Dual Cure Epoxy for Medical Applications

Master Bond UV15DC80-1Med offers a unique dual cure mechanism utilizing UV light for initial fixation followed by heat for complete polymerization. This addresses limitations ...
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Adhesives, encapsulants and bondings

Two Part, Silver Filled Silicone Adhesive Meets NASA Low Outgassing Specifications

Master Bond MasterSil 323S-LO is an addition cured silicone that is not only electrically conductive, but also thermally conductive. This ASTM E-595 low outgassing rated product...
Adhesives, encapsulants and bondings

Underfill Epoxy Offers High Glass Transition Temperature and Low Viscosity

Master Bond EP114 is a two component, low viscosity, NASA low outgassing rated, heat cured epoxy that can be effectively utilized for underfill, coating, impregnating and porosity...
Adhesives, encapsulants and bondings

One Part Epoxy Changes from Red to Clear Under UV Light

Master Bond UV15RCL is a low viscosity, cationic type UV curing system with a special color changing feature. The originally red material changes to clear once exposed to UV light...
Adhesives, encapsulants and bondings

Two Part Structural Epoxy Meets ISO 10993-5 for Non-Cytotoxicity

Master Bond Supreme 11AOHTMed is a two component epoxy featuring thermal conductivity and electrical insulation. This system fully passes ISO 10993-5 testing for non-cytotoxicity...
Adhesives, encapsulants and bondings

Food Grade Epoxy Features Enhanced Chemical Resistance

EP42HT-2FG Black is a two part, moderate heat cured epoxy with high temperature resistance that complies with FDA 21 CFR 175.105 for indirect food contact applications. The epoxy...
Adhesives, encapsulants and bondings

Flexible, Thixotropic, One Component Dual Cure Epoxy

Master Bond UV23FLDC-80TK is a moderate viscosity, cationic type system that offers both UV light and heat curing mechanisms. It cures readily within 20-30 seconds when exposed...
Master Sil711 Med
Adhesives, encapsulants and bondings

One Part RTV Silicone Passes Non-Cytotoxicity Standards

Master Bond MasterSil 711Med is a one component, medical grade silicone adhesive that resists temperatures up to 400°F.
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Adhesives, encapsulants and bondings

How Do You Use EP4EN-80 for Potting & Encapsulation Applications?

With its thin bond line thickness and low viscosity, EP4EN-80 is ideal for bonding, encapsulating and potting applications. Watch a real-life demonstration of how this epoxy compound...
Supreme17 Htnd 2
Adhesives, encapsulants and bondings

Toughened one-component epoxy features high-glass-transition temperature

Supreme 17HTND-2 cures at elevated temperatures with cure schedule options including 300°F for 4-6 hours or 350°F for 2-4 hours. An optimal cure schedule is at 300°F for 4-6 hours...
Ep40 Tc Med
Adhesives, encapsulants and bondings

EP40TCMed

Two component, thermally conductive, electrically insulative epoxy system for medical device applications
Ep40 Tc Med
Adhesives, encapsulants and bondings

Thermally Conductive, Electrically Insulative Epoxy for Medical Device Applications

Master Bond EP40TCMed is a two part, room temperature curing epoxy system that meets the requirements of ISO 10993-5 for non-cytotoxicity. It is thermally conductive, electrically...
Supreme3 Dm 85
Adhesives, encapsulants and bondings

Supreme 3DM-85

One component, toughened epoxy system for bonding, sealing, and dam-and-fill encapsulation
Supreme3 Dm 85
Adhesives, encapsulants and bondings

One Part, Toughened Epoxy for Dam-and-Fill Encapsulation

Master Bond Supreme 3DM-85 is a no mix, non-solvent based, one component epoxy. This thixotropic paste material was formulated to serve as the damming compound in dam-and-fill...
Ep5 Lte 100
Adhesives, encapsulants and bondings

EP5LTE-100

One component epoxy for bonding and sealing featuring a low coefficient of thermal expansion and a curing temperature of 100°C
Ep5 Lte 100
Adhesives, encapsulants and bondings

Thixotropic Epoxy Features Low Coefficient of Thermal Expansion

Master Bond EP5LTE-100 is a one part, non-premixed and frozen epoxy with a very low coefficient of thermal expansion (CTE), high glass transition temperature (Tg), and extremely...
Ep17 Htda 2
Adhesives, encapsulants and bondings

EP17HTDA-2

One component die attach epoxy system with exceptionally high glass transition temperature
Ep17 Htda 2
Adhesives, encapsulants and bondings

Die Attach Epoxy Featuring High Tg Meets NASA Low Outgassing Requirements

Master Bond EP17HTDA-2 is a one component epoxy that can be used for bonding, sealing and die attachment.
Led415 Dc90
Adhesives, encapsulants and bondings

Dual Curable Adhesive Offers Rapid Fixturing with LED Light

Master Bond LED415DC90 is a one component adhesive system that cures rapidly upon exposure to a 405 nm wavelength LED light source without any oxygen inhibition. The rate of cure...
Ep41 S 5 Med
Adhesives, encapsulants and bondings

Non-Cytotoxic Epoxy Withstands Multiple Methods of Medical Sterilization

Master Bond EP41S-5Med is a two part epoxy system that meets the requirements of ISO 10993-5 for non-cytotoxicity and can be used for bonding, sealing, and coating in medical ...

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