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Master Bond Logo 400x300b
Adhesives, encapsulants and bondings

Master Bond

Master Bond custom formulates adhesives, sealants and coatings for structural bonding and electronic applications for aerospace and defense manufacturers, for over 45 years.

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EP21LSCL-2Med
Adhesives, encapsulants and bondings

Low Viscosity, Optically Clear Epoxy Passes ISO 10993-5 Standard

Developed for medical device applications, Master Bond EP21LSCL-2Med is a two component non-cytotoxic epoxy for bonding, sealing, coating and potting. While most if not all epoxies...
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EP3HT-LO
Adhesives, encapsulants and bondings

One Part, Fast Curing Epoxy Meets NASA Low Outgassing Specifications

Master Bond EP3HT-LO is a single component, non-premixed & frozen, heat cured epoxy, with an unlimited working life at room temperature. This system passes ASTM E595 tests...
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UV11-3
Adhesives, encapsulants and bondings

UV11-3: Used to create a self-written waveguide for f iber-to-lithium niobate chip coupling to reduce coupling losses

Overview of UV11-3 Master Bond UV11-3 is a hard, super-abrasion-resistant coating system for various substrates. It can be cured readily by ultraviolet (UV) exposure at around...
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EP30HT-LO
Adhesives, encapsulants and bondings

EP30HT-LO: Utilized by NASA to bond components in lunar exploration vehicles

Overview of EP30HT-LOMaster Bond EP30HT-LO is a moderate-viscosity, two-component, epoxy system that can be cured at room temperature, or at elevated temperatures for a faster...
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Master Bond UV10TKLO-2
Adhesives, encapsulants and bondings

UV10TKLO-2: Used to Adhere Mirrors in a Kirkpatrick-Baez Microscope to Image X-ray Emissions During Deuterium-Tritium Implosions

Overview Master Bond UV10TKLO-2 is a one-component UV-curable system for high-performance bonding, sealing, and encapsulation applications. It meets NASA’s specifications...
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Master Bond EP21ARHTND-2
Adhesives, encapsulants and bondings

Non-Drip Epoxy Features Acid Resistance

Non-Drip Epoxy Features Acid Resistance Master Bond EP21ARHTND-2 is a two-part epoxy adhesive, designed to withstand prolonged exposure to a wide range of chemicals. “The...
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MasterSil 707FR-NV
Adhesives, encapsulants and bondings

MasterSil 707FR-NV

One component, room temperature curing, silicone elastomer
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Adhesives, encapsulants and bondings

One Component, Dual Cure Epoxy for Medical Applications

Master Bond UV15DC80-1Med offers a unique dual cure mechanism utilizing UV light for initial fixation followed by heat for complete polymerization. This addresses limitations ...
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Adhesives, encapsulants and bondings

Two Part, Silver Filled Silicone Adhesive Meets NASA Low Outgassing Specifications

Master Bond MasterSil 323S-LO is an addition cured silicone that is not only electrically conductive, but also thermally conductive. This ASTM E-595 low outgassing rated product...
Adhesives, encapsulants and bondings

Underfill Epoxy Offers High Glass Transition Temperature and Low Viscosity

Master Bond EP114 is a two component, low viscosity, NASA low outgassing rated, heat cured epoxy that can be effectively utilized for underfill, coating, impregnating and porosity...
Adhesives, encapsulants and bondings

One Part Epoxy Changes from Red to Clear Under UV Light

Master Bond UV15RCL is a low viscosity, cationic type UV curing system with a special color changing feature. The originally red material changes to clear once exposed to UV light...
Adhesives, encapsulants and bondings

Two Part Structural Epoxy Meets ISO 10993-5 for Non-Cytotoxicity

Master Bond Supreme 11AOHTMed is a two component epoxy featuring thermal conductivity and electrical insulation. This system fully passes ISO 10993-5 testing for non-cytotoxicity...
Adhesives, encapsulants and bondings

Food Grade Epoxy Features Enhanced Chemical Resistance

EP42HT-2FG Black is a two part, moderate heat cured epoxy with high temperature resistance that complies with FDA 21 CFR 175.105 for indirect food contact applications. The epoxy...
Adhesives, encapsulants and bondings

Flexible, Thixotropic, One Component Dual Cure Epoxy

Master Bond UV23FLDC-80TK is a moderate viscosity, cationic type system that offers both UV light and heat curing mechanisms. It cures readily within 20-30 seconds when exposed...
Master Sil711 Med
Adhesives, encapsulants and bondings

One Part RTV Silicone Passes Non-Cytotoxicity Standards

Master Bond MasterSil 711Med is a one component, medical grade silicone adhesive that resists temperatures up to 400°F.
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Adhesives, encapsulants and bondings

How Do You Use EP4EN-80 for Potting & Encapsulation Applications?

With its thin bond line thickness and low viscosity, EP4EN-80 is ideal for bonding, encapsulating and potting applications. Watch a real-life demonstration of how this epoxy compound...
Supreme17 Htnd 2
Adhesives, encapsulants and bondings

Toughened one-component epoxy features high-glass-transition temperature

Supreme 17HTND-2 cures at elevated temperatures with cure schedule options including 300°F for 4-6 hours or 350°F for 2-4 hours. An optimal cure schedule is at 300°F for 4-6 hours...
Ep40 Tc Med
Adhesives, encapsulants and bondings

EP40TCMed

Two component, thermally conductive, electrically insulative epoxy system for medical device applications
Ep40 Tc Med
Adhesives, encapsulants and bondings

Thermally Conductive, Electrically Insulative Epoxy for Medical Device Applications

Master Bond EP40TCMed is a two part, room temperature curing epoxy system that meets the requirements of ISO 10993-5 for non-cytotoxicity. It is thermally conductive, electrically...
Supreme3 Dm 85
Adhesives, encapsulants and bondings

Supreme 3DM-85

One component, toughened epoxy system for bonding, sealing, and dam-and-fill encapsulation
Supreme3 Dm 85
Adhesives, encapsulants and bondings

One Part, Toughened Epoxy for Dam-and-Fill Encapsulation

Master Bond Supreme 3DM-85 is a no mix, non-solvent based, one component epoxy. This thixotropic paste material was formulated to serve as the damming compound in dam-and-fill...
Ep5 Lte 100
Adhesives, encapsulants and bondings

EP5LTE-100

One component epoxy for bonding and sealing featuring a low coefficient of thermal expansion and a curing temperature of 100°C

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