Mouser is an authorized semiconductor and electronic component distributor focused on New Product Introductions from its manufacturing partners for electronic design engineers...
Master Bond custom formulates adhesives, sealants and coatings for structural bonding and electronic applications for aerospace and defense manufacturers, for over 45 years.
Master Bond EP62-1HTND is a two component epoxy system formulated for bonding and sealing applications requiring high temperature capability and chemical resistance, particularly...
Master Bond EP55TCFL is engineered for applications demanding efficient heat dissipation and electrical insulation. Its small particle filler enables thin bond lines, reducing...
What should engineers consider when choosing a low outgassing adhesive system for their application? The aerospace, electronic, and optical industries often involve environments...
Master Bond Supreme 10HTLV is a one part, non-frozen, heat cured epoxy formulated for demanding structural bonding applications. This toughened system features a moderately high...
In satellite and spacecraft design, adhesive selection is a mission-critical decision — one where failure is simply not an option. This eBook explores the critical...
Master Bond UV16Med-FD is a one part, low viscosity, epoxy based UV curable system containing a fluorescent dye for identification. This feature enables visual inspection with...
Optically Clear, High Flexibility Silicone Meets NASA Low Outgassing Specifications Master Bond MasterSil 981-LO is a two component, addition cured silicone system designed for...
Master Bond EP64 is a two-component, vacuum-compatible epoxy system engineered for bonding, sealing, and coating applications. It features a high glass transition temperature ...
One component, highly thermally conductive, silver filled epoxy, cures at 80-90°C Key Features Paste consistency Available in syringes and jars Unlimited working life, requires...
Master Bond UV26DCMed is a dual-cure epoxy system designed for medical applications. It utilizes UV light for the initial cure and heat to fully polymerize areas not directly ...
Master Bond UV26DCMed is a one component, dual cure adhesive system designed for medical device assembly. It is specifically engineered for reusable devices that require repeated...
Watch this demonstration to learn the step by step process of mixing a two part epoxy system, where Part A is a liquid and Part B is a powder. Epoxy system EP126 was used in this...
Two part epoxy with high thermal conductivity, electrically insulating, and low thermal resistance for bonding and sealing. Key Features Thermal conductivity exceeds 6...
Master Bond EP54TC is a two-component epoxy engineered for heat sink bonding and thermal management applications where efficient heat transfer is critical. Featuring the highest...
