Adhesives, encapsulants and bondings

With its thin bond line thickness and low viscosity, EP4EN-80 is ideal for bonding, encapsulating and potting applications. Watch a real-life demonstration of how this epoxy compound...

Supreme 17HTND-2 cures at elevated temperatures with cure schedule options including 300°F for 4-6 hours or 350°F for 2-4 hours. An optimal cure schedule is at 300°F for 4-6 hours...

Two component, thermally conductive, electrically insulative epoxy system for medical device applications

Master Bond EP40TCMed is a two part, room temperature curing epoxy system that meets the requirements of ISO 10993-5 for non-cytotoxicity. It is thermally conductive, electrically...

One component, toughened epoxy system for bonding, sealing, and dam-and-fill encapsulation

Master Bond Supreme 3DM-85 is a no mix, non-solvent based, one component epoxy. This thixotropic paste material was formulated to serve as the damming compound in dam-and-fill...

One component epoxy for bonding and sealing featuring a low coefficient of thermal expansion and a curing temperature of 100°C

Master Bond EP5LTE-100 is a one part, non-premixed and frozen epoxy with a very low coefficient of thermal expansion (CTE), high glass transition temperature (Tg), and extremely...

One component die attach epoxy system with exceptionally high glass transition temperature

Master Bond EP17HTDA-2 is a one component epoxy that can be used for bonding, sealing and die attachment.

One component, flexibilized LED curable system

Master Bond LED415DC90 is a one component adhesive system that cures rapidly upon exposure to a 405 nm wavelength LED light source without any oxygen inhibition. The rate of cure...

Master Bond EP41S-5Med is a two part epoxy system that meets the requirements of ISO 10993-5 for non-cytotoxicity and can be used for bonding, sealing, and coating in medical ...

Two component epoxy system featuring excellent resistance to sterilants, solvents and autoclaving

One component thermally conductive, electrically insulating epoxy with a curing temperature of 80 degrees Celsius

Master Bond EP5TC-80 is a one part, NASA low outgassing rated epoxy that achieves a thermal conductivity of 3.3-3.7 W/(m·K), while also retaining its electrical non-conductivity...

Two part thermally conductive, electrically insulating silicone for bonding and sealing

Master Bond EP4CL-80Med is a one part, optically clear epoxy developed for use in medical device assembly applications. It withstands repeated sterilization cycles and passes ...

One component, optically clear epoxy for bonding and sealing that cures at 80°C to 85°C for medical applications

Master Bond EP4CL-80Med is a one part, optically clear epoxy developed for use in medical device assembly applications. It withstands repeated sterilization cycles and passes ...