Adhesives, encapsulants and bondings

Overview of EP30HT-LOMaster Bond EP30HT-LO is a moderate-viscosity, two-component, epoxy system that can be cured at room temperature, or at elevated temperatures for a faster...

Overview Master Bond UV10TKLO-2 is a one-component UV-curable system for high-performance bonding, sealing, and encapsulation applications. It meets NASA’s specifications...

Non-Drip Epoxy Features Acid Resistance Master Bond EP21ARHTND-2 is a two-part epoxy adhesive, designed to withstand prolonged exposure to a wide range of chemicals. “The...

One component, room temperature curing, silicone elastomer

Master Bond UV15DC80-1Med offers a unique dual cure mechanism utilizing UV light for initial fixation followed by heat for complete polymerization. This addresses limitations ...

Master Bond MasterSil 323S-LO is an addition cured silicone that is not only electrically conductive, but also thermally conductive. This ASTM E-595 low outgassing rated product...

Master Bond EP114 is a two component, low viscosity, NASA low outgassing rated, heat cured epoxy that can be effectively utilized for underfill, coating, impregnating and porosity...

Master Bond UV15RCL is a low viscosity, cationic type UV curing system with a special color changing feature. The originally red material changes to clear once exposed to UV light...

Master Bond Supreme 11AOHTMed is a two component epoxy featuring thermal conductivity and electrical insulation. This system fully passes ISO 10993-5 testing for non-cytotoxicity...

EP42HT-2FG Black is a two part, moderate heat cured epoxy with high temperature resistance that complies with FDA 21 CFR 175.105 for indirect food contact applications. The epoxy...

Master Bond UV23FLDC-80TK is a moderate viscosity, cationic type system that offers both UV light and heat curing mechanisms. It cures readily within 20-30 seconds when exposed...

Master Bond MasterSil 711Med is a one component, medical grade silicone adhesive that resists temperatures up to 400°F.

With its thin bond line thickness and low viscosity, EP4EN-80 is ideal for bonding, encapsulating and potting applications. Watch a real-life demonstration of how this epoxy compound...

Supreme 17HTND-2 cures at elevated temperatures with cure schedule options including 300°F for 4-6 hours or 350°F for 2-4 hours. An optimal cure schedule is at 300°F for 4-6 hours...

Two component, thermally conductive, electrically insulative epoxy system for medical device applications

Master Bond EP40TCMed is a two part, room temperature curing epoxy system that meets the requirements of ISO 10993-5 for non-cytotoxicity. It is thermally conductive, electrically...

One component, toughened epoxy system for bonding, sealing, and dam-and-fill encapsulation

Master Bond Supreme 3DM-85 is a no mix, non-solvent based, one component epoxy. This thixotropic paste material was formulated to serve as the damming compound in dam-and-fill...

One component epoxy for bonding and sealing featuring a low coefficient of thermal expansion and a curing temperature of 100°C

Master Bond EP5LTE-100 is a one part, non-premixed and frozen epoxy with a very low coefficient of thermal expansion (CTE), high glass transition temperature (Tg), and extremely...