• Master Bond EP21AOLV-2LO
    Master Bond EP21AOLV-2LO
    Master Bond EP21AOLV-2LO is a two component, thermally conductive, electrically isolating epoxy adhesive, sealant, coating and encapsulant. It features very low exotherm during cure and withstands many chemicals over the wide temperature range of -60°F to +250°F. EP21AOLV-2LO has a low coefficient of thermal expansion and enhanced dimensional stability, along with both a high modulus and compressive strength. This versatile system adheres a wide variety of substrates and has a convenient, one to one mix ratio by weight.

    Request More Information

    By clicking above, I agree to Endeavor Business Media's Terms of Service and consent to receive promotional communications from Endeavor, its affiliates, and partners per its Privacy Notice. I also understand my personal information will be shared with the sponsor of this content, who may contact me about their offerings per their privacy policy. I can unsubscribe anytime.

    Latest in Adhesives, encapsulants and bondings

    Courtesy of Master Bond
    EP3HTSDA-2Med
    Image courtesy of Master Bond
    Master Bond UV15-7HP
    Image provided by Master Bond
    Master Bond EP29LPSPND-3
    Provided by YINCAE
    YINCAE
    Image provided by Master Bond
    Master Bond - Medical Grade, Dual Curable Adhesive