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    • Master Bond EP21AOLV-2LO
    Master Bond EP21AOLV-2LO
    Master Bond EP21AOLV-2LO is a two component, thermally conductive, electrically isolating epoxy adhesive, sealant, coating and encapsulant. It features very low exotherm during cure and withstands many chemicals over the wide temperature range of -60°F to +250°F. EP21AOLV-2LO has a low coefficient of thermal expansion and enhanced dimensional stability, along with both a high modulus and compressive strength. This versatile system adheres a wide variety of substrates and has a convenient, one to one mix ratio by weight.

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