EP29LPSPND-3

    Aug. 13, 2025
    Master Bond EP29LPSPND-3 is a two component, non-drip epoxy compound with a paste consistency that can be used for bonding and sealing applications.
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    EP29LPSPND-3

    The system is electrically non-conductive and thermally insulative, with a thermal conductivity of approximately 0.2 W/(m•K) at room temperature. It withstands cryogenic temperatures and is serviceable in the range from 4K to 250°F.

    EP29LPSPND-3 features a coefficient of thermal expansion of 45-50 x 10-6 in/in/°C, a tensile strength of 6,000-8,000 psi, and a Shore D hardness of 70-80. This system has a volume resistivity exceeding 1015 ohm-cm at 75°F and a dielectric constant of 4.2 at 60 Hz. A key performance attribute is its ability to withstand temperature cycling even at cryogenic levels. Learn More

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