Master Bond LED422DC90 is a one component, nanosilica filled dual cure adhesive system engineered for high-speed fixturing and bonding of opaque substrates. This unique "side-bonding" capability allows for rapid polymerization up to 3-4 mm in depth by exposing the adhesive to 405 nm LED light from an angle. The cure is then completed by a secondary heat cure at 90-95°C for 30-45 minutes. This two-tiered curing process allows for the precise and rapid fixturing of heat-sensitive components.