The Dawn ATR-3500 Series Rugged Enclosure offers a unique and innovative cooling concept, Thermal Exchanged Flow (TEF), in conjunction with standard Micro-TCA board platforms, resulting in the most cost-effective, rugged solution available. The TEF uses a two-stage cooling system consisting of a completely-sealed inner housing and forced air outer-housing. The inner-housing incorporates the power module, MCH module and up to four AMC modules.
• MicroTCA Rugged Conduction-Cooled Solution.
• 100% Sealed Electronics Compartment.
• Six-slot MicroTCA Backplane.
• Precision-Machined Card Guides result in Maximum Tolerances.
• Complete with Dawn’s RuSH System Health Monitor.
• 6061-T Aluminum Housing.
• MIL-STD-901D, MIL-STD-801F, MIL-STD-461E.
• CompactPCI and VPX Backplane Options.
