OpenVPX Ready Air Cooled Enclosure for deployed UAV or flight applications. Designed to MIL-STD-810E, DO-160E and MIL-STD-461E. For all rugged environments: Air, Land and Sea. 6-Slots of 3U VPX with integral 600 Watt 6-channel intelligent power supply.
The TEF uses a microcomputer controlled two stage cooling system consisting of a completely sealed inner-housing and a forced air outer-housing. The inner-housing incorporates a high velocity fan to move heat from the boards to the interior walls heat exchanger. Thermal energy passes through the walls to the external heat exchanger where it is removed by two high-CFM fans.
• Ideal packaging solution for UAV or flight deployed applications. • Thermal Exchanged Flow (TEF™) Cooling System. • Supports up to six 3U VPX air cooled modules.
• Fully sealed internal electronics compartment.
• Integral 600 Watt 6-Channel VPX intelligent power supply.
• Embedded Dawn RuSH technology actively monitors system voltage, current, temperature and talks over system management bus using I2C.
• Backplane topology and I/O is configurable at time of order using Dawn patented Fabric Mapping Modules (FMM).
